Inventor · disambiguated record
Jong Tae Moon
Also filed as: MOON JONG T · MOON JONG TAE · MOON JONG W
23 granted patents·21 pending applications·320 citations·filing 1997–2024
95Inventor score
Files withKOREA ELECTRONICS TELECOMM23EOM YONG SUNG4HOJEONABLE INC3BAE HYUN CHEOL2ELECTRONICS & TELECOMMUNICATIONS RES INST2
Top patents by PatentIndex Score
44 records- 0192US5854867AOptical module having lenses aligned on lens-positioning V-groove and fabrication method thereofKOREA ELECTRONICS TELECOMM·Filed 1997·Granted Dec 29, 1998·133 cites·23 claims
- 0288US7733207B2Vertically formed inductor and electronic device having the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Jun 8, 2010·18 cites·5 claims
- 0383US6297543B1Chip scale packageHYUNDAI ELECTRONICS IND·Filed 1999·Granted Oct 2, 2001·74 cites·9 claims
- 0482US9293689B2Method of manufacturing a piezoelectric micro energy harvesterKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Mar 22, 2016·4 cites·6 claims
- 0581US8211745B2Method and structure for bonding flip chipEOM YONG SUNG·Filed 2010·Granted Jul 3, 2012·7 cites·20 claims
- 0681US6707161B2Optical module package of flip chip bondingKOREA ELECTRONICS TELECOMM·Filed 2002·Granted Mar 16, 2004·20 cites·3 claims
- 0780US7009716B2System for monitoring optical output/wavelengthKOREA ELECTRONICS TELECOMM·Filed 2004·Granted Mar 7, 2006·17 cites·18 claims
- 0878US7520682B2Transceiver module and optical bench for passive alignmentKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Apr 21, 2009·9 cites·21 claims
- 0976US8030200B2Method for fabricating a semiconductor packageKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 4, 2011·6 cites·14 claims
- 1072US7553092B2Optical module and optical module packageKOREA ELECTRONICS TELECOMM·Filed 2006·Granted Jun 30, 2009·6 cites·17 claims
- 1171US8598768B2Piezoelectric micro energy harvester and manufacturing method thereofJUN CHI HOON·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 1269US8044757B2Electronic device including LTCC inductorKOREA ELECTRONICS TELECOMM·Filed 2009·Granted Oct 25, 2011·4 cites·10 claims
- 1369US2014318615A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofKOREA ELECTRONICS TELECOMM·Filed 2014·Application pending·0 cites
- 1468US6825065B2Method for optical module packaging of flip chip bondingKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Nov 30, 2004·9 cites·5 claims
- 1566US8420722B2Composition and methods of forming solder bump and flip chip using the sameEOM YONG SUNG·Filed 2009·Granted Apr 16, 2013·3 cites·10 claims
- 1666US2025065295A1Three-dimensional lithium adsorbent and method for preparing the sameHOJEONABLE INC·Filed 2024·Application pending·0 cites
- 1765US7298933B2Optical moduleKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Nov 20, 2007·2 cites·12 claims
- 1865US2023311250A1Copper sintering paste composition and method of preparing sameHOJEONABLE INC·Filed 2023·Application pending·0 cites
- 1964US9462736B2Composition and methods of forming solder bump and flip chip using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Oct 4, 2016·1 cites·8 claims
- 2063US2012222738A1Conductive composition, silicon solar cell including the same, and manufacturing method thereofOH SOO YOUNG·Filed 2012·Application pending·0 cites
- 2159US9980393B2Pattern-forming method for forming a conductive circuit patternELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted May 22, 2018·0 cites·15 claims
- 2258US2013146342A1Pattern-forming composition and pattern-forming method using the sameEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 2356US8723292B2Silicon interposer including backside inductorBAE HYUN-CHEOL·Filed 2012·Granted May 13, 2014·1 cites·4 claims
- 2455US9155236B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Oct 6, 2015·0 cites·4 claims
- 2554US7012939B2Wavelength stabilization module having light-receiving element array and method of manufacturing the sameKOREA ELECTRONICS TELECOMM·Filed 2003·Granted Mar 14, 2006·3 cites·10 claims
- 2654US2013074918A1Vacuum window glazing including solar cell and manufacturing method thereofJEONG JIN WOO·Filed 2012·Application pending·0 cites
- 2753US2012288983A1Method for manufacturing dye sensitized solar cell moduleCHU MOO JUNG·Filed 2012·Application pending·0 cites
- 2852US8802760B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Aug 12, 2014·0 cites·5 claims
- 2951US2023131422A1Light-absorbing epoxy film and manufacturing method thereofHOJEONABLE INC·Filed 2022·Application pending·0 cites
- 3050US2010142115A1Buried capacitor, method of manufacturing the same, and method of changing capacitance thereofKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 3147US7985697B2Wafer level package and method of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2008·Granted Jul 26, 2011·0 cites·5 claims
- 3245US2008285978A1Optical hybrid moduleKOREA ELECTRONICS TELECOMM·Filed 2008·Application pending·0 cites
- 3344US2010073238A1Microstrip patch antenna with high gain and wide band characteristicsKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 3443US2006126459A1Optical pickup device with phase shift mirrorSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 3543US2012240727A1Method of manufacturing solder powder having diameter of sub-micrometers or several micrometersEOM YONG SUNG·Filed 2012·Application pending·0 cites
- 3642US2005053380A1Optical transceiver for reducing crosstalkFiled 2004·Application pending·0 cites
- 3740US2007116472A1Package for optical transceiver moduleKOREA ELECTRONICS TELECOMM·Filed 2006·Application pending·0 cites
- 3840US2012161326A1Composition for filling through silicon via (tsv), tsv filling method and substrate including tsv plug formed of the compositionCHOI KWANG-SEONG·Filed 2011·Application pending·0 cites
- 3938US2011227228A1Filling composition, semiconductor device including the same, and method of fabricating the semiconductor deviceKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 4038US2005123249A1Structure for manufacturing optical moduleFiled 2004·Application pending·0 cites
- 4137US8524571B2Vacuum wafer level packaging method for micro electro mechanical system deviceMOON JONG TAE·Filed 2011·Granted Sep 3, 2013·0 cites·8 claims
- 4237US2011115036A1Device packages and methods of fabricating the sameKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 4337US2011090651A1Package structureKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
- 4431US2012154072A1Fbar duplexer module and fabrication method thereofBAE HYUN-CHEOL·Filed 2011·Application pending·0 cites
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