Inventor · disambiguated record
Yidnekachew S. Mekonnen
Also filed as: MEKONNEN YIDNEKACHEW · MEKONNEN YIDNEKACHEW S
20 granted patents·5 pending applications·35 citations·filing 2011–2025
91Inventor score
Top patents by PatentIndex Score
25 records- 0193US9859253B1Integrated circuit package stackINTEL CORP·Filed 2016·Granted Jan 2, 2018·12 cites·14 claims
- 0291US10651525B2Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubsINTEL CORP·Filed 2018·Granted May 12, 2020·5 cites·11 claims
- 0389US9992859B2Low loss and low cross talk transmission lines using shaped viasINTEL CORP·Filed 2015·Granted Jun 5, 2018·5 cites·4 claims
- 0478US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 0577US11791528B2Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial lineINTEL CORP·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 0677US11276635B2Horizontal pitch translation using embedded bridge diesINTEL CORP·Filed 2017·Granted Mar 15, 2022·2 cites·22 claims
- 0772US10186465B2Package-integrated microchannelsINTEL CORP·Filed 2015·Granted Jan 22, 2019·2 cites·25 claims
- 0871US11329358B2Low loss and low cross talk transmission lines having l-shaped cross sectionsINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·9 claims
- 0971US9515031B2Mitigation of far-end crosstalk induced by routing and out-of-plane interconnectsALTUNYURT NEVIN·Filed 2011·Granted Dec 6, 2016·5 cites·36 claims
- 1068US11694952B2Horizontal pitch translation using embedded bridge diesINTEL CORP·Filed 2022·Granted Jul 4, 2023·0 cites·25 claims
- 1166US10410939B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2015·Granted Sep 10, 2019·1 cites·25 claims
- 1259US10971416B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 1352US2023352416A1Methods and apparatus to improve signal integrity performance in integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1451US12073906B2Package pin pattern for device-to-device connectionINTEL CORP·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 1551US2025253259A1Methods and apparatus to compensate for impedance and reduce crosstalk in integrated circuit packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 1649US2024070366A1Adaptive trace width in multi-layer substrate packageINTEL CORP·Filed 2022·Application pending·0 cites
- 1748US11742293B2Multiple die package using an embedded bridge connecting diesINTEL CORP·Filed 2017·Granted Aug 29, 2023·0 cites·15 claims
- 1848US2023197675A1Packaging architecture with integrated circuit dies over input/output interfacesINTEL CORP·Filed 2021·Application pending·0 cites
- 1947US11145583B2Method to achieve variable dielectric thickness in packages for better electrical performanceINTEL CORP·Filed 2018·Granted Oct 12, 2021·0 cites·24 claims
- 2046US11322445B2EMIB copper layer for signal and power routingINTEL CORP·Filed 2016·Granted May 3, 2022·0 cites·20 claims
- 2145US11545416B2Minimization of insertion loss variation in through-silicon vias (TSVs)INTEL CORP·Filed 2017·Granted Jan 3, 2023·0 cites·27 claims
- 2243US11437366B2Tunable passive semiconductor elementsINTEL CORP·Filed 2017·Granted Sep 6, 2022·0 cites·13 claims
- 2343US10396036B2Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devicesINTEL CORP·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 2441US10992342B2Simplified multimode signaling techniquesINTEL CORP·Filed 2017·Granted Apr 27, 2021·0 cites·28 claims
- 2536US2019252321A1Interconnector with bundled interconnectsINTEL CORP·Filed 2016·Application pending·0 cites
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