Inventor · disambiguated record
Qinglei Zhang
Also filed as: ZHANG QINGLEI
21 granted patents·2 pending applications·144 citations·filing 2011–2024
94Inventor score
Top patents by PatentIndex Score
23 records- 0197US9147663B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2013·Granted Sep 29, 2015·34 cites·6 claims
- 0296US9831169B2Integrated circuit package substrateINTEL CORP·Filed 2016·Granted Nov 28, 2017·14 cites·15 claims
- 0396US9147638B2Interconnect structures for embedded bridgeINTEL CORP·Filed 2013·Granted Sep 29, 2015·51 cites·11 claims
- 0495US11694960B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 0593US9640485B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2015·Granted May 2, 2017·8 cites·16 claims
- 0693US9508636B2Integrated circuit package substrateINTEL CORP·Filed 2013·Granted Nov 29, 2016·14 cites·14 claims
- 0791US11133257B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2019·Granted Sep 28, 2021·4 cites·16 claims
- 0889US2025015004A1Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0986US9202803B2Laser cavity formation for embedded dies or components in substrate build-up layersZHANG CHONG·Filed 2014·Granted Dec 1, 2015·8 cites·14 claims
- 1083US12132002B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1176US9245795B2Methods of forming substrate microvias with anchor structuresINTEL CORP·Filed 2013·Granted Jan 26, 2016·3 cites·11 claims
- 1274US10325843B2Integrated circuit package substrateINTEL CORP·Filed 2017·Granted Jun 18, 2019·1 cites·19 claims
- 1370US10390438B2Integrated circuit package substrateINTEL CORP·Filed 2017·Granted Aug 20, 2019·1 cites·10 claims
- 1464US10475745B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2018·Granted Nov 12, 2019·0 cites·7 claims
- 1564US9832883B2Integrated circuit package substrateINTEL CORP·Filed 2013·Granted Nov 28, 2017·1 cites·9 claims
- 1662US10770387B2Integrated circuit package substrateINTEL CORP·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 1761US10103103B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2017·Granted Oct 16, 2018·0 cites·15 claims
- 1860US11166379B2Integrated circuit package substrateINTEL CORP·Filed 2019·Granted Nov 2, 2021·0 cites·3 claims
- 1960US9502336B2Coreless substrate with passive device padsINTEL CORP·Filed 2013·Granted Nov 22, 2016·1 cites·11 claims
- 2060US9299602B2Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) packageZHANG QINGLEI·Filed 2011·Granted Mar 29, 2016·2 cites·25 claims
- 2151US9449923B2Methods of forming substrate microvias with anchor structuresINTEL CORP·Filed 2015·Granted Sep 20, 2016·0 cites·27 claims
- 2247US9735120B2Low z-height package assemblyINTEL CORP·Filed 2013·Granted Aug 15, 2017·0 cites·19 claims
- 2342US2014376195A1Methods of forming dual sided coreless package structures with land side capacitorZHANG QINGLEI·Filed 2013·Application pending·0 cites
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