Inventor · disambiguated record
Keizo Kawakita
Also filed as: KAWAKITA KEIZO
50 granted patents·21 pending applications·847 citations·filing 1994–2025
98Inventor score
Files withMICRON TECHNOLOGY INC25HITACHI LTD21ELPIDA MEMORY INC13KAWAKITA KEIZO4TEXAS INSTRUMENTS INC3
Top patents by PatentIndex Score
71 records- 0195US6483136B1Semiconductor integrated circuit and method of fabricating the sameHITACHI LTD·Filed 1998·Granted Nov 19, 2002·90 cites·31 claims
- 0293US6028360ASemiconductor integrated circuit device in which a conductive film is formed over a trap film which in turn is formed over a titanium filmHITACHI LTD·Filed 1998·Granted Feb 22, 2000·101 cites·2 claims
- 0391US6649956B2Semiconductor integrated circuit device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 18, 2003·38 cites·19 claims
- 0491US6372554B1Semiconductor integrated circuit device and method for production of the sameHITACHI LTD·Filed 1999·Granted Apr 16, 2002·135 cites·21 claims
- 0591US6258649B1Semiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Jul 10, 2001·91 cites·11 claims
- 0690US7042038B2Semiconductor integrated circuit device and manufacturing method thereofHITACHI LTD·Filed 2003·Granted May 9, 2006·35 cites·8 claims
- 0789US7795689B2Semiconductor device including a germanium silicide film on a selective epitaxial layerELPIDA MEMORY INC·Filed 2007·Granted Sep 14, 2010·17 cites·20 claims
- 0888US6215144B1Semiconductor integrated circuit device, and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 10, 2001·73 cites·19 claims
- 0987US11637105B2Apparatus comprising compensation capacitorsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 1087US6399438B2Method of manufacturing semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2001·Granted Jun 4, 2002·32 cites·17 claims
- 1186US5804479AMethod for forming semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 1996·Granted Sep 8, 1998·58 cites·25 claims
- 1283US10811365B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 20, 2020·3 cites·18 claims
- 1381US5578849ASemiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitanceHITACHI LTD·Filed 1994·Granted Nov 26, 1996·35 cites·14 claims
- 1475US7525829B2Semiconductor storage deviceELPIDA MEMORY INC·Filed 2006·Granted Apr 28, 2009·9 cites·16 claims
- 1575US6605530B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2002·Granted Aug 12, 2003·14 cites·24 claims
- 1674US8093130B2Method of manufacturing a semiconductor device having raised source and drain of differing heightsKAWAKITA KEIZO·Filed 2008·Granted Jan 10, 2012·5 cites·14 claims
- 1772US12125789B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 22, 2024·0 cites·16 claims
- 1871US11158640B2Apparatus comprising compensation capacitors and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 26, 2021·1 cites·17 claims
- 1971US6853081B2Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2003·Granted Feb 8, 2005·11 cites·18 claims
- 2070US8653666B2Semiconductor storage device having a peripheral circuit region and a memory cell regionKAWAKITA KEIZO·Filed 2010·Granted Feb 18, 2014·3 cites·20 claims
- 2170US2025218990A1Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2268US12255163B2Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 18, 2025·0 cites·13 claims
- 2368US6638811B2Method of manufacturing a semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2002·Granted Oct 28, 2003·9 cites·8 claims
- 2467US12347797B2Apparatus, semiconductor device, and redistribution layer structure thereofMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 1, 2025·0 cites·19 claims
- 2566US12217816B2Semiconductor wiring device and methodMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 4, 2025·0 cites·17 claims
- 2665US11616028B2Semiconductor devices having crack-inhibiting structuresMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 28, 2023·0 cites·19 claims
- 2765US11456253B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·7 claims
- 2863US12211757B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 28, 2025·0 cites·18 claims
- 2961US6777279B2Semiconductor integrated circuit device and manufacturing method thereofRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·8 cites·7 claims
- 3060US2025149391A1Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3159US6753219B2Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devicesHITACHI LTD·Filed 2002·Granted Jun 22, 2004·8 cites·7 claims
- 3259US6060352AMethod of manufacturing semiconductor device with increased focus marginHITACHI LTD·Filed 1998·Granted May 9, 2000·16 cites·32 claims
- 3358US11862554B2Apparatuses and methods of controlling hydrogen supply in memory deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·0 cites·22 claims
- 3458US11810822B2Apparatuses and methods including patterns in scribe regions of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 3558US7884418B2Semiconductor device and transistorELPIDA MEMORY INC·Filed 2008·Granted Feb 8, 2011·1 cites·8 claims
- 3657US11569089B2Method of forming a semiconductor device, and a photomask used thereinMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 31, 2023·0 cites·13 claims
- 3756US11769736B2Scribe structure for memory deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 26, 2023·0 cites·15 claims
- 3856US6492730B1Method for fabricating semiconductor integrated circuitHITACHI LTD·Filed 2000·Granted Dec 10, 2002·4 cites·10 claims
- 3956US5933726AMethod of forming a semiconductor device have a screen stacked cell capacitorTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 3, 1999·17 cites·4 claims
- 4055US11658121B2Semiconductor device and method of forming the sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·14 claims
- 4155US11600578B2Scribe structure for memory deviceMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 7, 2023·0 cites·16 claims
- 4253US2023377967A1Method of forming through silicon via and trench using the same mask layerMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4353US2024162154A1Semiconductor device having contact plugMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4452US2023290720A1Apparatuses including metal-insulator-metal capacitor and methods for forming sameMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4551US2024071972A1Semiconductor conductive pillar device and methodMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4650US11587870B2Apparatus comprising aluminum interconnections, memory devices comprising interconnections, and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 21, 2023·0 cites·29 claims
- 4750US7119443B2Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen elementHITACHI LTD·Filed 2004·Granted Oct 10, 2006·2 cites·5 claims
- 4848US8080470B2Wiring structure and semiconductor device, and their fabrication methodsKAWAKITA KEIZO·Filed 2008·Granted Dec 20, 2011·0 cites·12 claims
- 4948US2008048275A1Mos transistor, semiconductor device, and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 5048US2009014802A1Semiconductor device and method for manufacturing the sameELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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