Inventor · disambiguated record
Tsuyoshi Osaga
Also filed as: OSAGA TSUYOSHI
8 granted patents·4 pending applications·11 citations·filing 2013–2022
77Inventor score
Files withMITSUBISHI ELECTRIC CORP12
Top patents by PatentIndex Score
12 records- 0183US9716052B2Semiconductor device comprising a conductive film joining a diode and switching elementMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jul 25, 2017·7 cites·6 claims
- 0272US9530766B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Dec 27, 2016·3 cites·3 claims
- 0364US10964524B2Semiconductor manufacturing method for cutting a waferMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 30, 2021·1 cites·3 claims
- 0450US2025287624A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0545US12148712B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 19, 2024·0 cites·22 claims
- 0644US12087706B2Semiconductor device including groove in termination regionMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 10, 2024·0 cites·9 claims
- 0744US2025142974A1Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0844US2024014206A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0943US11876062B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 16, 2024·0 cites·10 claims
- 1043US2023040727A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1141US10685932B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 16, 2020·0 cites·20 claims
- 1240US11069769B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 20, 2021·0 cites·3 claims
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