Inventor · disambiguated record
Ahmer Syed
Also filed as: SYED AHMER · SYED AHMER R · SYED AHMER RAZA
15 granted patents·5 pending applications·466 citations·filing 1994–2024
94Inventor score
Technology areasH10W
Files withQUALCOMM INC9AMKOR TECHNOLOGY INC5DELCO ELECTRONICS CORP1GALLOWAY JESSE E1KUO BOB SHIH-WEI1
Top patents by PatentIndex Score
20 records- 0197US9379090B1System, apparatus, and method for split die interconnectionQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·43 cites·27 claims
- 0295US9484291B1Robust pillar structure for semicondcutor device contactsAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·38 cites·22 claims
- 0395US6608366B1Lead frame with plated end leadsFiled 2002·Granted Aug 19, 2003·152 cites·21 claims
- 0492US9013011B1Stacked and staggered die MEMS package and methodKUO BOB SHIH-WEI·Filed 2011·Granted Apr 21, 2015·18 cites·21 claims
- 0591US9806063B2Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliabilityQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·9 cites·23 claims
- 0691US7183630B1Lead frame with plated end leadsAMKOR TECHNOLOGY INC·Filed 2003·Granted Feb 27, 2007·90 cites·20 claims
- 0788US9420378B1Top port MEMS microphone package and methodSYED AHMER RAZA·Filed 2010·Granted Aug 16, 2016·14 cites·20 claims
- 0883US12218041B2Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2021·Granted Feb 4, 2025·1 cites·20 claims
- 0983US10236268B1Robust pillar structure for semicondcutor device contactsAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 19, 2019·4 cites·22 claims
- 1080US10327076B1Top port MEMS package and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 18, 2019·3 cites·19 claims
- 1179US8217507B1Edge mount semiconductor packageGALLOWAY JESSE E·Filed 2010·Granted Jul 10, 2012·8 cites·20 claims
- 1278US6885086B1Reduced copper lead frame for saw-singulated chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 26, 2005·29 cites·20 claims
- 1376US5491364AReduced stress terminal pattern for integrated circuit devices and packagesDELCO ELECTRONICS CORP·Filed 1994·Granted Feb 13, 1996·54 cites·17 claims
- 1476US2025118645A1Integrated circuit (ic) packages employing a capacitor-embedded, redistribution layer (rdl) substrate for interfacing an ic chip(s) to a package substrate, and related methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1566US8912051B1Method for controlling molding compound geometry around a semiconductor dieSYED AHMER·Filed 2012·Granted Dec 16, 2014·3 cites·20 claims
- 1658US12500188B2Flip-chip bumping metal layer and bump structureQUALCOMM INC·Filed 2023·Granted Dec 16, 2025·0 cites·27 claims
- 1757US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1852US2024079307A1Package comprising a substrate with post interconnects having a profile cross section of a trapezoid shapeQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1947US2021375845A1Package cavity for enhanced device performance with an integrated passive deviceQUALCOMM INC·Filed 2020·Application pending·0 cites
- 2037US2018331061A1Integrated device comprising bump on exposed redistribution interconnectQUALCOMM INC·Filed 2017·Application pending·0 cites
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