Inventor · disambiguated record
Chun-Yao Wang
Also filed as: WANG CHUN · WANG CHUN-YAO
10 granted patents·10 pending applications·36 citations·filing 2000–2025
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4UNIV TSINGHUA3NAT UNIV TSING HUA2TOPRAY TECHNOLOGIES INC2CHEN YUNG-CHIH1
Top patents by PatentIndex Score
20 records- 0182US12302631B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 0278US2025261444A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US9228260B1Wafer processing chamber, heat treatment apparatus and method for processing wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 5, 2016·3 cites·20 claims
- 0475US7427876B1Reversible sequential element and reversible sequential circuit thereofUNIV TSINGHUA·Filed 2007·Granted Sep 23, 2008·11 cites·16 claims
- 0571US11923360B2Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 0668US7418721B2Apparatus for aligning and clipping different size compact discs for disc deviceTOPRAY TECHNOLOGIES INC·Filed 2006·Granted Aug 26, 2008·2 cites·15 claims
- 0768US6675337B1Built-in self verification circuit for system chip designIND TECH RES INST·Filed 2000·Granted Jan 6, 2004·16 cites·10 claims
- 0863US7987476B2Apparatus for clamping large and small disksTOPRAY TECHNOLOGIES INC·Filed 2008·Granted Jul 26, 2011·1 cites·6 claims
- 0953US7432738B1Reversible sequential apparatusesUNIV TSINGHUA·Filed 2007·Granted Oct 7, 2008·3 cites·20 claims
- 1049US2011131539A1Rewiring using irredundancy removal and additionNAT UNIV TSING HUA·Filed 2009·Application pending·0 cites
- 1147US2021408644A1Bonding structure of electrical contact, bonding method of electrical contact and battery moduleSIMPLO TECH CO LTD·Filed 2021·Application pending·0 cites
- 1247US2023000349A1Fundus cameraMEDIMAGING INTEGRATED SOLUTION INC·Filed 2022·Application pending·0 cites
- 1345US2009191686A1Method for Preparing Doped Polysilicon Conductor and Method for Preparing Trench Capacitor Structure Using the SamePROMOS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 1440US10177165B1Method for fabricating merging semiconductor integrated circuitUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·0 cites·9 claims
- 1539US2011246829A1Method for Fast Detection of Node Mergers and Simplification of a CircuitNAT UNIV TSING HUA·Filed 2010·Application pending·0 cites
- 1638US2013048922A1Method for preparing quantum dots of lead selenideZHOU MINGJIE·Filed 2010·Application pending·0 cites
- 1738US2012066542A1Method for Node Addition and Removal of a CircuitCHEN YUNG-CHIH·Filed 2010·Application pending·0 cites
- 1837US7302655B2Method for verifying a circuit design by assigning numerical values to inputs of the circuit designUNIV TSINGHUA·Filed 2005·Granted Nov 27, 2007·0 cites·9 claims
- 1937US2012216155A1Checking method for mask design of integrated circuitSHIH PING-CHIA·Filed 2011·Application pending·0 cites
- 2036US2007050789A1Device for reducing the backlash of optical pickup head of optical disk deviceWANG CHUN-YAO·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →