Inventor · disambiguated record
Wen-Ping Huang
Also filed as: HUANG WEN-PING
9 granted patents·5 pending applications·35 citations·filing 1996–2021
82Inventor score
Files withHUANG WEN-PING4FORMOSA MICROSEMI CO LTD2INVENTEC CORP2CHEW CHIENG PLASTICS CO LTD1CHI MEI CORP1
Top patents by PatentIndex Score
14 records- 0164US5668207AStyrenic resin compositionCHI MEI CORP·Filed 1996·Granted Sep 16, 1997·20 cites·7 claims
- 0259US9064856B1Flip-chip LED component built therein with a zener chipFORMOSA MICROSEMI CO LTD·Filed 2014·Granted Jun 23, 2015·3 cites·4 claims
- 0352US7446401B2Structure of power semiconductor with twin metal and ceramic platesHUANG WEN-PING·Filed 2005·Granted Nov 4, 2008·1 cites·6 claims
- 0449US6334971B1Manufacturing method for diode group processed by injection molding on the surfaceFiled 2000·Granted Jan 1, 2002·6 cites·8 claims
- 0546US2022204125A1Elastic assembly structure for a bicycle pedalCHEW CHIENG PLASTICS CO LTD·Filed 2021·Application pending·0 cites
- 0645US2010106951A1Computer system and method for transmitting system information of configuration management program thereofINVENTEC CORP·Filed 2009·Application pending·0 cites
- 0744US8560867B2Server system and method for processing power offLU YING-CHIH·Filed 2011·Granted Oct 15, 2013·0 cites·8 claims
- 0838US2011113225A1Basic input/output system capable of supporting multi-platforms and constructing method thereofINVENTEC CORP·Filed 2010·Application pending·0 cites
- 0933US2013075891A1Flip chip type full wave rectification semiconductor device and its manufacturing methodHUANG WEN-PING·Filed 2011·Application pending·0 cites
- 1031US8404565B2Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plateHUANG WEN-PING·Filed 2010·Granted Mar 26, 2013·0 cites·12 claims
- 1131US6085396AManufacturing method for rectifying diodesFiled 1999·Granted Jul 11, 2000·5 cites·6 claims
- 1229US2005259400A1Heat sinking structure of power semiconductorFORMOSA MICROSEMI CO LTD·Filed 2004·Application pending·0 cites
- 1324US8791551B2Well-through type diode element/component and manufacturing method for themHUANG WEN-PING·Filed 2012·Granted Jul 29, 2014·0 cites·4 claims
- 1423US8742533B2Constant current semiconductor device having a schottky barrierTSAI SHEAU-FENG·Filed 2011·Granted Jun 3, 2014·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →