P

Inventor

LEE TAE-GON

KR8 patents
⚠️ This page may combine multiple inventors who share the name “LEE TAE-GON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

4 patents
US7408261B2Aug 5, 2008

BGA package board and method for manufacturing the same

SAMSUNG ELECTRO MECH34 citations91
US7414317B2Aug 19, 2008

BGA package with concave shaped bonding pads

SAMSUNG ELECTRO MECH12 citations82
US7802361B2Sep 28, 2010

Method for manufacturing the BGA package board

SAMSUNG ELECTRO MECH3 citations61
US7768116B2Aug 3, 2010

Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same

SAMSUNG ELECTRO MECH2 citations61

SAMSUNG ELECTRONICS CO LTD

1 patent
US12598744B2Apr 7, 2026

Semiconductor device and electronic system including the same

SAMSUNG ELECTRONICS CO LTD0 citations49

YOON KYOUNG RO

1 patent
US8236690B2Aug 7, 2012

Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

YOON KYOUNG RO0 citations49

KIM TAE-GUI

1 patent
US8084696B2Dec 27, 2011

Printed circuit board and manufacturing method thereof

KIM TAE-GUI0 citations43

JEON HYUNG-JIN

1 patent
US8106308B2Jan 31, 2012

Printed circuit board for package and manufacturing method thereof

JEON HYUNG-JIN0 citations35