Inventor · disambiguated record
Chin-Chuan Chang
Also filed as: CHANG CHIN-CHUAN
64 granted patents·21 pending applications·1,680 citations·filing 1993–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD55CHANG CHIN-CHUAN6LAM RES CORP4LIANG FEI IND CO LTD2LIN JING-CHENG2
Top patents by PatentIndex Score
85 records- 0199US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 0298US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 0398US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 0497US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 0596US9431367B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·17 cites·19 claims
- 0695US11929261B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 12, 2024·3 cites·20 claims
- 0795US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 0894US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 0993US10276516B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·6 cites·20 claims
- 1093US9741689B23-D package having plurality of substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·7 cites·20 claims
- 1192US8933551B23D-packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 13, 2015·10 cites·20 claims
- 1292US5271502AFile holderCHANG CHIN CHUAN·Filed 1993·Granted Dec 21, 1993·63 cites·1 claims
- 1390US8785026B2Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery systemHU HSIEN-LIN·Filed 2010·Granted Jul 22, 2014·31 cites·32 claims
- 1490US2025364462A1Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1589US8872326B2Three dimensional (3D) fan-out packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 1688US2025273631A1Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1787US10672631B2Method and system for substrate thinningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·3 cites·20 claims
- 1887US2025357353A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1986US9960125B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·3 cites·20 claims
- 2085US10518387B2Grinding element, grinding wheel and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·4 cites·19 claims
- 2184US12482773B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 2283US2025316564A1Semiconductor Package and Method of Manufacturing the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2382US8459004B2Oxygen sensor bung of motor vehicle exhaust pipeCHANG CHIN-CHUAN·Filed 2010·Granted Jun 11, 2013·5 cites·6 claims
- 2482US8443928B2Exhaust tail pipeCHANG CHIN-CHUAN·Filed 2010·Granted May 21, 2013·5 cites·7 claims
- 2581US11239180B2Structure and formation method of package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 1, 2022·2 cites·20 claims
- 2680US12412841B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 2780US12131965B2Apparatus for detecting end pointTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 2880US2024387330A1Semiconductor Package and Method of Manufacturing the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2979US12074112B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 3079US11996375B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 3179US9679783B2Molding wafer chamberLIN JING-CHENG·Filed 2011·Granted Jun 13, 2017·4 cites·23 claims
- 3277US9941244B2Protective layer for contact pads in fan-out interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 10, 2018·3 cites·24 claims
- 3376US11469218B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 3476US2024387196A1Semiconductor Package and Method of Manufacturing The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3575US12255079B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 3675US10017008B1Subsidiary loudspeaker for vehicles and bikesLIANG FEI IND CO LTD·Filed 2017·Granted Jul 10, 2018·3 cites·7 claims
- 3774US12255155B2Package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 3874US11728190B2System for thinning substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 3973US11362046B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 4073US2025174578A1Package structure with stacked semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4172US11670597B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 4272US11616034B2Integrated circuit structure, and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 4371US11056364B2Method for substrate thinningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 4470US2024128157A9Semiconductor Package and Method of Manufacturing the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4569US11862523B2Apparatus for detecting end pointTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 4669US9953907B2PoP deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 24, 2018·2 cites·19 claims
- 4769US9425128B23-D package having plurality of substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·1 cites·19 claims
- 4868US11515288B2Protective layer for contact pads in fan-out interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 4967US6289526B1Automatic cleaner for a toilet seatFiled 2000·Granted Sep 18, 2001·14 cites·10 claims
- 5066US11854984B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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