Inventor · disambiguated record
Kazuya Fujioka
Also filed as: FUJIOKA KAZUYA
6 granted patents·11 pending applications·29 citations·filing 2007–2022
78Inventor score
Files withNITTO DENKO CORP11AUTONETWORKS TECHNOLOGIES LTD1DMG MORI CO LTD1DMG MORI SEIKI CO LTD1FUJIOKA KAZUYA1
Top patents by PatentIndex Score
17 records- 0190US9341334B2Optical filmNITTO DENKO CORP·Filed 2015·Granted May 17, 2016·7 cites·6 claims
- 0282US8734964B2Etching resistKURIHARA KAZUMA·Filed 2009·Granted May 27, 2014·11 cites·19 claims
- 0373US8047750B2Bearing unit and main spindle device of machine tool provided with bearing unitMORI SEIKI SEISAKUSHO KK·Filed 2007·Granted Nov 1, 2011·5 cites·5 claims
- 0471US8814769B2Machine tool and tool holderFUJIOKA KAZUYA·Filed 2010·Granted Aug 26, 2014·6 cites·5 claims
- 0559US2025001538A1Machine tool, control method, and control programDMG MORI CO LTD·Filed 2022·Application pending·0 cites
- 0658US2022325115A1Composition for peelable-coating-film formation and peelable coating filmNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0754US2022389238A1Peelable coating film, coating-material set, and coating material for hydrophilic-coating-film formationNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0852US2022089884A1Method for debonding debondable coating film and articleNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 0951US2021387230A1Method for debonding debondable coating film and laminateNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 1049US2014106487A1Optical-semiconductor encapsulating materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1147US9333608B2Machine tool and tool holderDMG MORI SEIKI CO LTD·Filed 2014·Granted May 10, 2016·0 cites·5 claims
- 1246US2010148378A1Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereofNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1344US2015072160A1Method for producing optical film and daylighting filmNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1443US2011079816A1Optical-semiconductor encapsulating materialNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1540US10636545B2Wiring harnessAUTONETWORKS TECHNOLOGIES LTD·Filed 2017·Granted Apr 28, 2020·0 cites·5 claims
- 1639US2010209670A1Sheet for photosemiconductor encapsulationNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1736US2011079929A1Kit for optical semiconductor encapsulationNITTO DENKO CORP·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →