Inventor · disambiguated record
Han Kim
Also filed as: KIM HAN · KIM HAN-GU
54 granted patents·10 pending applications·182 citations·filing 2001–2025
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD55JEON CHAN-HEE3SAMSUNG ELECTRO MECH2CHOI YOUNG WOOK1HYUNDAI MOTOR CO LTD1
Top patents by PatentIndex Score
64 records- 0190US7280329B2Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clampSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 9, 2007·50 cites·6 claims
- 0286US10607914B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·4 cites·20 claims
- 0385US11108229B2Electrostatic discharge (ESD) protection circuit and integrated circuit including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 31, 2021·5 cites·20 claims
- 0484US10453821B2Connection system of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 22, 2019·4 cites·25 claims
- 0581US7763941B2Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clampSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 27, 2010·8 cites·37 claims
- 0681US6981873B2Dental implant and head for a compaction drillCHOI YOUNG-WOOK·Filed 2001·Granted Jan 3, 2006·49 cites·16 claims
- 0780US10790239B2Semiconductor package and board for mounting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·3 cites·28 claims
- 0879US12308336B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 20, 2025·0 cites·16 claims
- 0979US10600679B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 24, 2020·3 cites·21 claims
- 1079US10483197B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 19, 2019·4 cites·17 claims
- 1179US2025279383A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1278US10573589B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·15 claims
- 1378US9093287B2Diode, ESD protection circuit and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 28, 2015·6 cites·16 claims
- 1476US10672719B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·2 cites·9 claims
- 1574US10672727B2Semiconductor package providing protection from electrical noiseSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 2, 2020·2 cites·13 claims
- 1673US11881467B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·19 claims
- 1773US9799641B2Electrostatic discharge protection device and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 24, 2017·2 cites·10 claims
- 1873US7888739B2Electrostatic discharge circuit and method of dissipating an electrostatic currentSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 15, 2011·5 cites·20 claims
- 1973US7417282B2Vertical double-diffused metal oxide semiconductor (VDMOS) device incorporating reverse diodeSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 26, 2008·6 cites·17 claims
- 2072US10748833B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·17 claims
- 2171US10985126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 2270US10770403B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·16 claims
- 2369US11410958B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 9, 2022·0 cites·20 claims
- 2466US9270105B2Clamping circuit, a semiconductor apparatus including the same, and a clamping method of the semiconductor apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 2565US10373884B2Fan-out semiconductor package for packaging semiconductor chip and capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 6, 2019·1 cites·24 claims
- 2664US11791298B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 2764US8358490B2Transistor with EOS protection and ESD protection circuit including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 22, 2013·3 cites·16 claims
- 2864US7697249B2Voltage clamping circuits using MOS transistors and semiconductor chips having the same and methods of clamping voltagesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 13, 2010·5 cites·20 claims
- 2964US7243628B2Apparatus and method for assembling crankshaft-sprocketHYUNDAI MOTOR CO LTD·Filed 2005·Granted Jul 17, 2007·3 cites·9 claims
- 3063US11901269B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3160US11742308B2Semiconductor package for reducing stress to redistribution viaSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·16 claims
- 3260US10886192B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 5, 2021·0 cites·20 claims
- 3360US10872851B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 22, 2020·0 cites·20 claims
- 3460US7898034B2Semiconductor chips having improved electrostatic discharge protection circuit arrangementSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·1 cites·23 claims
- 3559US9620502B2Semiconductor device including an extended impurity regionJEON CHAN-HEE·Filed 2014·Granted Apr 11, 2017·1 cites·23 claims
- 3658US10923464B2Connection system of semiconductor packages using a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 3754US11164838B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·17 claims
- 3853US10714440B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 3953US8705219B2Electrostatic discharge protection circuitSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 22, 2014·1 cites·20 claims
- 4053US7465993B2Semiconductor chips having improved electrostatic discharge protection circuit arrangementSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 16, 2008·0 cites·20 claims
- 4152US10734342B2Semiconductor package for reducing stress to redistribution viaSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·16 claims
- 4252US10535643B2Connection system of semiconductor packages using a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·18 claims
- 4351US10134723B2Electrostatic discharge protection device and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·19 claims
- 4451US10020231B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 10, 2018·0 cites·10 claims
- 4550US10403588B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 4650US10318678B2Method of three-dimensional optoelectrical simulation of image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 11, 2019·0 cites·12 claims
- 4748US10396049B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 27, 2019·0 cites·23 claims
- 4848US2020211938A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4946US2005100861A1Dental implant and head for a compaction drillFiled 2004·Application pending·0 cites
- 5045US2020126924A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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