Inventor · disambiguated record
Hirofumi Kozakai
Also filed as: KOZAKAI HIROFUMI
17 granted patents·26 citations·filing 2013–2023
90Inventor score
Files withHOYA CORP17
Top patents by PatentIndex Score
17 records- 0198US11480867B2Reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2021·Granted Oct 25, 2022·4 cites·21 claims
- 0295US11650494B2Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing methodHOYA CORP·Filed 2022·Granted May 16, 2023·2 cites·19 claims
- 0391US10001699B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2016·Granted Jun 19, 2018·6 cites·14 claims
- 0490US11256167B2Substrate with a multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing methodHOYA CORP·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 0585US9740091B2Substrate with multilayer reflective film, reflective mask blank for EUV lithography, reflective mask for EUV lithography, and method of manufacturing the same, and method of manufacturing a semiconductor deviceHOYA CORP·Filed 2014·Granted Aug 22, 2017·4 cites·14 claims
- 0684US11003068B2Reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2018·Granted May 11, 2021·2 cites·20 claims
- 0781US12135496B2Reflective mask blank and reflective maskHOYA CORP·Filed 2023·Granted Nov 5, 2024·0 cites·20 claims
- 0881US9897909B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2016·Granted Feb 20, 2018·2 cites·8 claims
- 0978US11880130B2Reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2022·Granted Jan 23, 2024·0 cites·19 claims
- 1075US9348217B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2013·Granted May 24, 2016·2 cites·15 claims
- 1174US9494851B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2013·Granted Nov 15, 2016·2 cites·30 claims
- 1265US10620527B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 1360US10429728B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2017·Granted Oct 1, 2019·0 cites·21 claims
- 1460US10295900B2Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask, and semiconductor device fabrication methodHOYA CORP·Filed 2018·Granted May 21, 2019·0 cites·26 claims
- 1553US11454878B2Substrate with multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2018·Granted Sep 27, 2022·0 cites·19 claims
- 1645US9507254B2Method of manufacturing substrate with a multilayer reflective film, method of manufacturing a reflective mask blank, substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing a semiconductor deviceHOYA CORP·Filed 2013·Granted Nov 29, 2016·0 cites·17 claims
- 1742US10347485B2Reflective mask blank, method for manufacturing same, reflective mask, method for manufacturing same, and method for manufacturing semiconductor deviceHOYA CORP·Filed 2015·Granted Jul 9, 2019·0 cites·34 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →