Inventor · disambiguated record
Dae Hyeong Lee
Also filed as: LEE DAE HYEONG
9 granted patents·10 pending applications·13 citations·filing 2002–2015
80Inventor score
Top patents by PatentIndex Score
19 records- 0177US10119994B2Probe card having lead part for removing excessive solderSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 6, 2018·2 cites·21 claims
- 0263US7869146B2Lens moduleSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 11, 2011·4 cites·13 claims
- 0360US9095065B2Method of repairing probe board and probe board using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 28, 2015·0 cites·7 claims
- 0455US6714101B2Noise reduction filter arraySAMSUNG ELECTRO MECH·Filed 2002·Granted Mar 30, 2004·7 cites·7 claims
- 0548US9374885B2Ceramic elements moduleSAMSUNG ELECTRO MECH·Filed 2012·Granted Jun 21, 2016·0 cites·6 claims
- 0648US2011079420A1Ceramic multilayer and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0747US8307546B2Method for manufacturing a ceramic elements moduleHWANG GYU MAN·Filed 2009·Granted Nov 13, 2012·0 cites·7 claims
- 0847US8183473B2Optimized power package for electrical deviceHWANG GYU MAN·Filed 2009·Granted May 22, 2012·0 cites·5 claims
- 0946US2015173196A1Capacitor embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1040US8806731B2Method of repairing a probe boardCHANG MYUNG WHUN·Filed 2011·Granted Aug 19, 2014·0 cites·8 claims
- 1140US2013162280A1Probe card and method of manufacturing the sameCHUNG DOO YUN·Filed 2012·Application pending·0 cites
- 1240US2013088251A1Probe card and manufacturing method thereofCHOI YONG SEOK·Filed 2012·Application pending·0 cites
- 1339US2013000958A1Multilayer ceramic substrate and method for manufacturing the sameSAMSUNG ELECTRO MECHANCIS CO LTD·Filed 2012·Application pending·0 cites
- 1438US2011149530A1Printed circuit board assemblySAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1536US2013162278A1Probe pin, probe card using the probe pin, and method of manufacturing the probe cardCHUNG DOO YUN·Filed 2012·Application pending·0 cites
- 1635US2011168439A1Multilayer ceramic circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1734US8330049B2Circuit board module and method of manufacturing the sameCHOI YOON HYUCK·Filed 2009·Granted Dec 11, 2012·0 cites·16 claims
- 1832US2011061919A1Low temperature co-fired ceramics assembling system and method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1930US2012040125A1Method for manufacturing ceramic substrate and ceramic substrate using the sameCHANG MYUNG WHUN·Filed 2011·Application pending·0 cites
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