Inventor · disambiguated record
Thomas Licht
Also filed as: LICHT THOMAS · LICHT THOMAS A · LICHT THOMAS ANTHONY
14 granted patents·4 pending applications·124 citations·filing 1990–2009
91Inventor score
Files withINFINEON TECHNOLOGIES AG5BALL CORP2BAYERER REINHOLD2AUERBACH FRANZ1CROWN PACKAGING TECHNOLOGY INC1
Top patents by PatentIndex Score
18 records- 0192US7755185B2Arrangement for cooling a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 13, 2010·28 cites·50 claims
- 0287US8006826B2Star wheel with vacuum capability for retaining conveyed articlesCROWN PACKAGING TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·19 cites·13 claims
- 0386US7557442B2Power semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 7, 2009·17 cites·6 claims
- 0473US7963463B2Compressed air foam and high pressure liquid dispersal systemINTELAGARD INC·Filed 2005·Granted Jun 21, 2011·9 cites·41 claims
- 0565US5141111ASystem and method for inspecting and rejecting defective containersBALL CORP·Filed 1990·Granted Aug 25, 1992·26 cites·28 claims
- 0664US7566490B2Composite material and base plateINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 28, 2009·5 cites·19 claims
- 0761US8167187B2Method and device for producing a bondable area region on a carrierBAYERER REINHOLD·Filed 2006·Granted May 1, 2012·2 cites·22 claims
- 0861US7407836B2High-voltage module and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 5, 2008·2 cites·4 claims
- 0960US7742843B2Method for the structured application of a laminatable film to a substrate for a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 22, 2010·2 cites·22 claims
- 1048US7078795B2High voltage module and method for producing sameEUPEC GMBH & CO KG·Filed 2003·Granted Jul 18, 2006·3 cites·15 claims
- 1146US8439249B2Device and method for making a semiconductor device including bonding two bonding partnersSPECKELS ROLAND·Filed 2009·Granted May 14, 2013·0 cites·13 claims
- 1244US5139132AOrientation apparatus and method for disk shaped partsBALL CORP·Filed 1991·Granted Aug 18, 1992·10 cites·32 claims
- 1342US8198721B2Semiconductor moduleBAYERER REINHOLD·Filed 2006·Granted Jun 12, 2012·0 cites·15 claims
- 1441US7807931B2Electrical component on a substrate and method for production thereofSIEMENS AG·Filed 2004·Granted Oct 5, 2010·1 cites·4 claims
- 1539US2006076389A1Method and apparatus for controlling and monitoring a brazing processKEMPER ALFRED·Filed 2005·Application pending·0 cites
- 1637US2007036944A1Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assemblyAUERBACH FRANZ·Filed 2004·Application pending·0 cites
- 1733US2006267135A1Circuit arrangement placed on a substrate and method for producing the sameWOLFGANG ECKHARD·Filed 2004·Application pending·0 cites
- 1832US2007200227A1Power semiconductor arrangementLICHT THOMAS·Filed 2006·Application pending·0 cites
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