Inventor · disambiguated record
Yeu Wen Lee
Also filed as: LEE YEU WEN
5 granted patents·34 citations·filing 2003–2010
78Inventor score
Top patents by PatentIndex Score
5 records- 0173US7144538B2Method for making a direct chip attach device and structureSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 5, 2006·13 cites·17 claims
- 0260US7105378B2Method of forming a leadframe for a semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Sep 12, 2006·9 cites·11 claims
- 0358US8461670B2Semiconductor component and method of manufactureCELAYA PHILLIP·Filed 2010·Granted Jun 11, 2013·3 cites·20 claims
- 0455US7755179B2Semiconductor package structure having enhanced thermal dissipation characteristicsSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Jul 13, 2010·8 cites·5 claims
- 0551US7247931B2Semiconductor package and leadframe therefor having angled cornersSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jul 24, 2007·1 cites·7 claims
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