Inventor · disambiguated record
Ein Sun Ng
Also filed as: NG EIN SUN
3 granted patents·1 pending application·11 citations·filing 2004–2009
62Inventor score
Top patents by PatentIndex Score
4 records- 0160US7105378B2Method of forming a leadframe for a semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Sep 12, 2006·9 cites·11 claims
- 0251US7247931B2Semiconductor package and leadframe therefor having angled cornersSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jul 24, 2007·1 cites·7 claims
- 0345US8093707B2Leadframe packages having enhanced ground-bond reliabilityLEE SHAW WEI·Filed 2009·Granted Jan 10, 2012·1 cites·15 claims
- 0445US2011140253A1Dap ground bond enhancementNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →