Inventor · disambiguated record

Kazuhito Hikasa

Also filed as: HIKASA KAZUHITO

1 granted patent·70 citations·filing 1995–1995

51Inventor score

Technology areasB23K

Files withFURUKAWA ELECTRIC CO LTD1

Top patents by PatentIndex Score

1 record

0185US5453582ACircuit board to be precoated with solder layers and solder circuit boardFURUKAWA ELECTRIC CO LTD·Filed 1995·Granted Sep 26, 1995·70 cites·14 claims

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