Inventor · disambiguated record
Tito Mangaoang
Also filed as: MANGAOANG JR TITO · MANGAOANG TITO
6 granted patents·34 citations·filing 2017–2020
78Inventor score
Files withST MICROELECTRONICS INC6
Top patents by PatentIndex Score
6 records- 0196US9972558B1Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2017·Granted May 15, 2018·23 cites·20 claims
- 0292US10388594B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2017·Granted Aug 20, 2019·10 cites·21 claims
- 0371US11658098B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 0471US10672689B2Protection from ESD during the manufacturing process of semiconductor chipsST MICROELECTRONICS INC·Filed 2019·Granted Jun 2, 2020·1 cites·20 claims
- 0561US10840168B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2018·Granted Nov 17, 2020·0 cites·20 claims
- 0660US10141246B2Leadframe package with side solder ball contact and method of manufacturingST MICROELECTRONICS INC·Filed 2018·Granted Nov 27, 2018·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →