Inventor · disambiguated record
Mark M. Konarski
Also filed as: KONARSKI MARK · KONARSKI MARK M
24 granted patents·1 pending application·442 citations·filing 1998–2019
96Inventor score
Top patents by PatentIndex Score
25 records- 0192US6632893B2Composition of epoxy resin, cyanate ester, imidazole and polysulfide toughenersHENKEL LOCTITE CORP·Filed 2001·Granted Oct 14, 2003·98 cites·24 claims
- 0290US7547735B1UV curable compositionsHENKEL CORP·Filed 2006·Granted Jun 16, 2009·13 cites·8 claims
- 0389US10141532B2Curable encapsulants and use thereofHenkel IP & Holding GmbH·Filed 2017·Granted Nov 27, 2018·2 cites·19 claims
- 0488US9676928B2Curable encapsulants and use thereofHenkel IP & Holding GmbH·Filed 2014·Granted Jun 13, 2017·6 cites·14 claims
- 0588US6458472B1Fluxing underfill compositionsHENKEL LOCTITE CORP·Filed 2001·Granted Oct 1, 2002·53 cites·21 claims
- 0685US7915319B2Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositionsHENKEL CORP·Filed 2005·Granted Mar 29, 2011·11 cites·14 claims
- 0784US7109061B2Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewithHENKEL CORP·Filed 2001·Granted Sep 19, 2006·51 cites·27 claims
- 0883US6391993B1High temperature, controlled strength anaerobic compositions curable under ambient environmental conditionsLOCTITE CORP·Filed 1998·Granted May 21, 2002·36 cites·38 claims
- 0982US9080084B2Photolytically induced redox curable compositionsHenkel US IP LLC·Filed 2014·Granted Jul 14, 2015·2 cites·11 claims
- 1081US6667194B1Method of bonding die chip with underfill fluxing compositionHENKEL LOCTITE CORP·Filed 2002·Granted Dec 23, 2003·33 cites·7 claims
- 1171US10995210B2Curable compositionsHenkel IP & Holding GmbH·Filed 2019·Granted May 4, 2021·0 cites·26 claims
- 1269US6617399B2Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide toughenersHENKEL LOCTITE CORP·Filed 2001·Granted Sep 9, 2003·15 cites·12 claims
- 1369US6519968B1Shipping container for exothermic materialLOCTITE CORP·Filed 2001·Granted Feb 18, 2003·18 cites·12 claims
- 1468US6706417B2Fluxing underfill compositionsHENKEL LOCTITE CORP·Filed 2002·Granted Mar 16, 2004·17 cites·21 claims
- 1568US6670430B1Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexesHENKEL LOCTITE CORP·Filed 2000·Granted Dec 30, 2003·12 cites·15 claims
- 1663US7087304B1Polysulfide-based toughening agents, compositions containing same and methods for the use thereofHENKEL CORP·Filed 2003·Granted Aug 8, 2006·11 cites·13 claims
- 1760US7193016B1Epoxy-extended polyacrylate toughening agentHENKEL CORP·Filed 2003·Granted Mar 20, 2007·4 cites·5 claims
- 1860US7009009B1Fluxing underfill compositionsHENKEL CORP·Filed 2003·Granted Mar 7, 2006·10 cites·12 claims
- 1959US6893736B2Thermosetting resin compositions useful as underfill sealantsHENKEL CORP·Filed 2002·Granted May 17, 2005·8 cites·24 claims
- 2059US6818318B2Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complexHENKEL CORP·Filed 2003·Granted Nov 16, 2004·7 cites·28 claims
- 2157US7108920B1Reworkable compositions incorporating episulfide resinsLOCTITE R & D LTD·Filed 2000·Granted Sep 19, 2006·8 cites·18 claims
- 2255US6342577B1Thermosetting resin compositions useful as underfill sealantsLOCTITE CORP·Filed 1998·Granted Jan 29, 2002·22 cites·25 claims
- 2353US6951907B1Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complexHENKEL CORP·Filed 2003·Granted Oct 4, 2005·5 cites·23 claims
- 2444US2007267134A1Photoinitiated Cationic Epoxy CompositionsKONARSKI MARK M·Filed 2005·Application pending·0 cites
- 2538US10815388B2Primer compositions for injection moldingHenkel IP & Holding GmbH·Filed 2015·Granted Oct 27, 2020·0 cites·15 claims
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