Inventor · disambiguated record
Hongqing Sun
Also filed as: SUN HONGQING
7 granted patents·5 pending applications·0 citations·filing 2013–2025
70Inventor score
Top patents by PatentIndex Score
12 records- 0183US2024393773A1Methods and apparatus for 2-d and 3-d scanning path visualizationGEN ELECTRIC·Filed 2024·Application pending·0 cites
- 0281US12061466B2Methods and apparatus for 2-D and 3-D scanning path visualizationGEN ELECTRIC·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 0380US12485607B2Tooling assembly for decreasing powder usage in a powder bed additive manufacturing processGEN ELECTRIC·Filed 2023·Granted Dec 2, 2025·0 cites·18 claims
- 0473US2025265388A1Additive manufacturing simulationsGEN ELECTRIC·Filed 2025·Application pending·0 cites
- 0572US11813798B2Additive manufacturing systems and methods of pretreating and additively printing on workpiecesGEN ELECTRIC·Filed 2022·Granted Nov 14, 2023·0 cites·16 claims
- 0669US11537111B2Methods and apparatus for 2-D and 3-D scanning path visualizationGEN ELECTRIC·Filed 2020·Granted Dec 27, 2022·0 cites·19 claims
- 0768US11298884B2Additive manufacturing systems and methods of pretreating and additively printing on workpiecesGEN ELECTRIC·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 0864US2020238386A1Tooling Assembly for Decreasing Powder Usage in a Powder Bed Additive Manufacturing ProcessGEN ELECTRIC·Filed 2019·Application pending·0 cites
- 0963US12299358B2Additive manufacturing simulationsGEN ELECTRIC·Filed 2021·Granted May 13, 2025·0 cites·16 claims
- 1059US12240055B2Optical zoom in additive manufacturingVULCANFORMS INC·Filed 2021·Granted Mar 4, 2025·0 cites·30 claims
- 1147US2015060042A1Electrical submersible pump and pump system including additively manufactured structures and method of manufactureGEN ELECTRIC·Filed 2013·Application pending·0 cites
- 1245US2022088680A1Additive manufacturing system and methods for repairing componentsGEN ELECTRIC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →