Inventor · disambiguated record
Yao-Bin Wang
Also filed as: Wang yao bin
6 granted patents·18 citations·filing 2011–2020
80Inventor score
Technology areasH10D
Top patents by PatentIndex Score
6 records- 0189US8569129B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsMa wei yu·Filed 2011·Granted Oct 29, 2013·9 cites·20 claims
- 0284US9406607B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·5 cites·20 claims
- 0382US10269699B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 0481US9893010B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·2 cites·20 claims
- 0571US11075162B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 0663US10629528B2Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectricsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
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