Inventor · disambiguated record
Alfred Haimerl
Also filed as: HAIMERL ALFRED
37 granted patents·3 pending applications·302 citations·filing 2001–2017
97Inventor score
Top patents by PatentIndex Score
40 records- 0194US7749797B2Semiconductor device having a sensor chip, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 6, 2010·36 cites·23 claims
- 0292US7464603B2Sensor component with a cavity housing and a sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 16, 2008·26 cites·15 claims
- 0390US6897568B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 24, 2005·52 cites·19 claims
- 0488US7795727B2Semiconductor module having discrete components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·17 cites·14 claims
- 0586US7705436B2Semiconductor device with semiconductor chip and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·13 cites·37 claims
- 0685US7629660B2Semiconductor sensor component including a sensor chip and methods for the manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·14 cites·16 claims
- 0785US7462940B2Semiconductor component comprising flip chip contacts with polymer cores and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 9, 2008·13 cites·15 claims
- 0885US7443019B2Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 28, 2008·13 cites·13 claims
- 0978US7768107B2Semiconductor component including semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·8 cites·13 claims
- 1076US8507080B2Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting materialMAHLER JOACHIM·Filed 2006·Granted Aug 13, 2013·7 cites·14 claims
- 1176US8017438B2Semiconductor module with at least two substratesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 13, 2011·7 cites·7 claims
- 1276US8013441B2Power semiconductor device in lead frame employing connecting element with conductive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 6, 2011·7 cites·20 claims
- 1376US7312533B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 25, 2007·19 cites·38 claims
- 1475US7230309B2Semiconductor component and sensor component for data transmission devicesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 12, 2007·23 cites·10 claims
- 1574US7834467B2Layer between interfaces of different components in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·6 cites·17 claims
- 1672US9633927B2Chip arrangement and method for producing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 25, 2017·2 cites·19 claims
- 1772US7589403B2Lead structure for a semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 15, 2009·5 cites·10 claims
- 1870US8178390B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2006·Granted May 15, 2012·3 cites·11 claims
- 1970US7612457B2Semiconductor device including a stress bufferINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 3, 2009·5 cites·27 claims
- 2070US7268423B2Flexible rewiring plate for semiconductor components, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·12 cites·17 claims
- 2166US7880300B2Semiconductor chip comprising a metal coating structure and associated production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·3 cites·23 claims
- 2261US10198684B2Smart card module, smart card, and method for producing a smart card moduleINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 5, 2019·1 cites·20 claims
- 2361US7911039B2Component arrangement comprising a carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 22, 2011·1 cites·16 claims
- 2459US7820482B2Method of producing an electronic component with flexible bondingQIMONDA AG·Filed 2005·Granted Oct 26, 2010·1 cites·7 claims
- 2558US9859198B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 2, 2018·0 cites·5 claims
- 2658US7645642B2Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset compositeINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 12, 2010·1 cites·17 claims
- 2757US10128180B2Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·0 cites·13 claims
- 2855US6956287B2Electronic component with flexible bonding pads and method of producing such a componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 18, 2005·5 cites·20 claims
- 2953US8440733B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2012·Granted May 14, 2013·0 cites·18 claims
- 3052US8519547B2Chip arrangement and method for producing a chip arrangementMAHLER JOACHIM·Filed 2012·Granted Aug 27, 2013·0 cites·14 claims
- 3152US8129831B2Chip arrangement and method for producing a chip arrangementMAHLER JOACHIM·Filed 2007·Granted Mar 6, 2012·0 cites·9 claims
- 3250US2014001622A1Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packagesBAUER MICHAEL·Filed 2012·Application pending·0 cites
- 3349US7504711B2Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 17, 2009·0 cites·16 claims
- 3448US7714422B2Electronic module with a semiconductor chip and a component housing and methods for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 11, 2010·0 cites·11 claims
- 3547US8354299B2Semiconductor component having a stack of semiconductor chips and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jan 15, 2013·0 cites·7 claims
- 3645US6949820B2Substrate-based chip packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 27, 2005·2 cites·16 claims
- 3744US7728053B2Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing compositionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 1, 2010·0 cites·14 claims
- 3844US2008303172A1Method for stacking semiconductor chips and semiconductor chip stack produced by the methodBAUER MICHAEL·Filed 2007·Application pending·0 cites
- 3944US2007278637A1Circuit Arrangement, System Carrier and Methods for Producing SameINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4037US6914328B2Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layersINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 5, 2005·0 cites·17 claims
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