Inventor · disambiguated record
Satyavolu Srinivas Papa Rao
Also filed as: RAO SATYAVOLU S PAPA · RAO SATYAVOLU SRINIVAS PAPA
11 granted patents·3 pending applications·102 citations·filing 2003–2007
90Inventor score
Top patents by PatentIndex Score
14 records- 0189US7189615B2Single mask MIM capacitor and resistor with in trench copper drift barrierTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 13, 2007·18 cites·19 claims
- 0287US7338893B2Integration of pore sealing liner into dual-damascene methods and devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 4, 2008·17 cites·14 claims
- 0383US7212607B1X-ray confocal defect detection systems and methodsTEXAS INSTRUMENTS INC·Filed 2006·Granted May 1, 2007·9 cites·24 claims
- 0478US7148140B2Partial plate anneal plate process for deposition of conductive fill materialTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 12, 2006·27 cites·17 claims
- 0573US7566627B2Air gap in integrated circuit inductor fabricationTEXAS INSTRUMENTS INC·Filed 2007·Granted Jul 28, 2009·5 cites·16 claims
- 0671US7781884B2Method of fabrication of on-chip heat pipes and ancillary heat transfer componentsTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 24, 2010·5 cites·23 claims
- 0768US7678713B2Energy beam treatment to improve packaging reliabilityTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 16, 2010·4 cites·16 claims
- 0868US7531398B2Methods and devices employing metal layers in gates to introduce channel strainTEXAS INSTRUMENTS INC·Filed 2006·Granted May 12, 2009·4 cites·29 claims
- 0961US7256121B2Contact resistance reduction by new barrier stack processTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 14, 2007·7 cites·21 claims
- 1055US8211794B2Properties of metallic copper diffusion barriers through silicon surface treatmentsARUNACHALAM VALLI·Filed 2007·Granted Jul 3, 2012·2 cites·21 claims
- 1154US7153706B2Ferroelectric capacitor having a substantially planar dielectric layer and a method of manufacture thereforTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 26, 2006·4 cites·26 claims
- 1244US2009087956A1Dummy Contact Fill to Improve Post Contact Chemical Mechanical Polish TopographyTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1338US2004157456A1Surface defect elimination using directed beam methodFiled 2004·Application pending·0 cites
- 1438US2005037613A1Diffusion barrier for copper lines in integrated circuitsFiled 2003·Application pending·0 cites
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