Inventor · disambiguated record
Harold Miyamura
Also filed as: MIYAMURA HAROLD · MIYAMURA HAROLD KARL
18 granted patents·1 pending application·212 citations·filing 2002–2023
94Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO8NVIDIA CORP5BAIDU USA LLC2NETWORK APPLIANCE INC2HEWELETT PACKARD DEV COMPANY L1
Top patents by PatentIndex Score
19 records- 0198US10791647B1Carrier safety device for heavy equipment in an immersion cooling systemBAIDU USA LLC·Filed 2019·Granted Sep 29, 2020·42 cites·20 claims
- 0294US11882678B2Redundant isolation of rack manifolds for datacenter cooling systemsNVIDIA CORP·Filed 2020·Granted Jan 23, 2024·4 cites·24 claims
- 0394US10820447B1Immersion cooling system with top mounted bus barBAIDU USA LLC·Filed 2019·Granted Oct 27, 2020·11 cites·20 claims
- 0494US7312999B1High density drive chassis assemblyNETWORK APPLIANCE INC·Filed 2005·Granted Dec 25, 2007·55 cites·40 claims
- 0581US11700713B2Fastening systems for manifolds of datacenter racksNVIDIA CORP·Filed 2020·Granted Jul 11, 2023·2 cites·18 claims
- 0678US12245405B2Fastening systems for manifolds of datacenter racksNVIDIA CORP·Filed 2023·Granted Mar 4, 2025·0 cites·16 claims
- 0775US6992893B2Heat sink attachmentHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jan 31, 2006·25 cites·60 claims
- 0871US7140422B2Heat sink with heat pipe in direct contact with componentHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Nov 28, 2006·17 cites·26 claims
- 0970US6758679B2Installation instruction conveying device (electronic components) mechanicalHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 6, 2004·8 cites·25 claims
- 1069US7542296B1Keying implementation for swapping paired devicesNETWORK APPLIANCE INC·Filed 2005·Granted Jun 2, 2009·4 cites·7 claims
- 1169US7379303B2Computing device moduleHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 27, 2008·15 cites·48 claims
- 1268US7389599B2System and method for providing access to equipment identity informationHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 24, 2008·10 cites·5 claims
- 1368US7143819B2Heat sink with angled heat pipeHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 5, 2006·14 cites·26 claims
- 1465US11860067B2Thermal test vehicleNVIDIA CORP·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1553US11864359B2Intelligent threshold leak remediaton of datacenter cooling systemsNVIDIA CORP·Filed 2020·Granted Jan 2, 2024·0 cites·10 claims
- 1649US6646341B2Heat sink apparatus utilizing the heat sink shroud to dissipate heatHEWELETT PACKARD DEV COMPANY L·Filed 2002·Granted Nov 11, 2003·4 cites·26 claims
- 1738US2003210968A1Fastener assemblyFiled 2002·Application pending·0 cites
- 1831USD485843SBezel having a pull out labelHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jan 27, 2004·1 cites·1 claims
- 1929USD546827SBezel for rack-mounted deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jul 17, 2007·0 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →