Inventor · disambiguated record
Hui-Chung Liu
Also filed as: LIU HUI-CHUNG
9 granted patents·2 pending applications·14 citations·filing 2019–2024
79Inventor score
Files withADVANCED SEMICONDUCTOR ENG11
Top patents by PatentIndex Score
11 records- 0193US10812017B1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 20, 2020·12 cites·17 claims
- 0278US2025096774A1Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0376US12184266B2Electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 0476US11088054B2Lead frame and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 10, 2021·2 cites·17 claims
- 0566US11588470B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 0664US11296651B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 5, 2022·0 cites·5 claims
- 0759US11817397B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 14, 2023·0 cites·19 claims
- 0850US11217499B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·4 claims
- 0949US11527671B2Optical package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 13, 2022·0 cites·16 claims
- 1048US12321513B2Body-part tracking device and body-part tracking methodADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 3, 2025·0 cites·19 claims
- 1145US2021358823A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →