Inventor · disambiguated record
Ji Young Chung
Also filed as: CHUNG JI YOUNG
56 granted patents·8 pending applications·280 citations·filing 2003–2025
98Inventor score
Top patents by PatentIndex Score
64 records- 0199US7170183B1Wafer level stacked packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·146 cites·17 claims
- 0295US9728476B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 8, 2017·11 cites·7 claims
- 0395US7723852B1Stacked semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted May 25, 2010·39 cites·18 claims
- 0494US9984947B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 29, 2018·9 cites·13 claims
- 0589US7956453B1Semiconductor package with patterning layer and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted Jun 7, 2011·15 cites·19 claims
- 0688US7906855B1Stacked semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2010·Granted Mar 15, 2011·9 cites·20 claims
- 0787US12438110B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Oct 7, 2025·0 cites·19 claims
- 0886US2024321658A1Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0985US11018079B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2017·Granted May 25, 2021·3 cites·13 claims
- 1084US12476171B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Nov 18, 2025·0 cites·15 claims
- 1183US12002725B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 4, 2024·0 cites·31 claims
- 1282US11342276B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted May 24, 2022·4 cites·15 claims
- 1382US10446455B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Oct 15, 2019·2 cites·14 claims
- 1482US2024258225A1Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1582US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1680US12388032B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1780US10707181B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 7, 2020·3 cites·16 claims
- 1880US7718523B1Solder attach film and method of forming solder ball using the sameAMKOR TECHNOLOGY INC·Filed 2007·Granted May 18, 2010·8 cites·7 claims
- 1980US2025133864A1Electronic sensor devices and methods of manufacturing electronic sensor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2079US11990435B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 2178US10600755B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 24, 2020·2 cites·19 claims
- 2278US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
- 2377US9184148B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
- 2477US2025157956A1Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 2576US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 2676US11682598B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 20, 2023·0 cites·11 claims
- 2775US2024355744A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2874US12176443B2Electronic sensor devices and methods of manufacturing electronic sensor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 24, 2024·0 cites·18 claims
- 2974US2025155105A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 3073US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 3172US12237239B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 3272US11961794B2Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 3372US11908779B2Land structure for semiconductor package and method thereforAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 20, 2024·0 cites·19 claims
- 3472US11600582B2Semiconductor device with redistribution layers formed utilizing dummy substratesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 7, 2023·0 cites·12 claims
- 3572US11177187B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 3672US9552999B2Packaged electronic device having reduced parasitic effects and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·2 cites·20 claims
- 3771US12033946B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Jul 9, 2024·0 cites·19 claims
- 3871US10297515B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted May 21, 2019·1 cites·15 claims
- 3970US9922919B2Electronic package structure having insulated substrate with lands and conductive patternsAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 20, 2018·1 cites·6 claims
- 4070US9412729B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 9, 2016·2 cites·20 claims
- 4169US9911685B2Land structure for semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·1 cites·17 claims
- 4268US9418942B2Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·2 cites·20 claims
- 4368US7847398B2Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturingAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 7, 2010·4 cites·16 claims
- 4467US11594512B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 4565US11393734B2Fingerprint sensor and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 19, 2022·0 cites·15 claims
- 4664US11342268B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted May 24, 2022·0 cites·11 claims
- 4764US10943884B2Method of manufacturing an electronic device and electronic device manufactured therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Mar 9, 2021·0 cites·20 claims
- 4863US10672676B2Sensor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 4962US8729710B1Semiconductor package with patterning layer and method of making sameKIM DO HYEONG·Filed 2011·Granted May 20, 2014·2 cites·10 claims
- 5060US2022246542A1Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →