Inventor · disambiguated record
Adwait Telang
Also filed as: TELANG ADWAIT
1 granted patent·2 pending applications·16 citations·filing 2006–2022
37Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0187US9716066B2Interconnect structure comprising fine pitch backside metal redistribution lines combined with viasINTEL CORP·Filed 2013·Granted Jul 25, 2017·16 cites·16 claims
- 0251US2024222283A1Methods and apparatus to prevent over-etch in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0333US2008003715A1Tapered die-side bumpsLEE KEVIN J·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →