Inventor · disambiguated record
John Muirhead
Also filed as: MUIRHEAD JOHN
1 granted patent·1 pending application·16 citations·filing 2013–2016
37Inventor score
Technology areasH10W
Files withINTEL CORP2
Top patents by PatentIndex Score
2 records- 0187US9716066B2Interconnect structure comprising fine pitch backside metal redistribution lines combined with viasINTEL CORP·Filed 2013·Granted Jul 25, 2017·16 cites·16 claims
- 0232US2019237391A1Chip assemblies employing solder bonds to back-side lands including an electrolytic nickel layerINTEL CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →