Inventor · disambiguated record
Kai-Ming Ching
Also filed as: CHING KAI-MING
45 granted patents·1 pending application·934 citations·filing 2000–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG30TAIWAN SEMICONDUCTOR MFG CO LTD5CHING KAI-MING2KUO CHEN-CHENG2CHANG SHIH-CHENG1
Top patents by PatentIndex Score
46 records- 0199US7564115B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·155 cites·15 claims
- 0298US7973413B2Through-substrate via for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 5, 2011·132 cites·15 claims
- 0397US8476769B2Through-silicon vias and methods for forming the sameCHEN CHIH-HUA·Filed 2007·Granted Jul 2, 2013·67 cites·27 claims
- 0497US7843064B2Structure and process for the formation of TSVsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 30, 2010·75 cites·18 claims
- 0597US7816227B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 19, 2010·45 cites·20 claims
- 0697US6743660B2Method of making a wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 1, 2004·110 cites·20 claims
- 0794US8034708B2Structure and process for the formation of TSVsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 11, 2011·13 cites·21 claims
- 0893US7514797B2Multi-die wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 7, 2009·22 cites·19 claims
- 0991US9355933B2Cooling channels in 3DIC stacksTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·9 cites·20 claims
- 1090US6636313B2Method of measuring photoresist and bump misalignmentTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·37 cites·20 claims
- 1189US8426256B2Method of forming stacked-die packagesHSIAO C W·Filed 2010·Granted Apr 23, 2013·21 cites·20 claims
- 1289US6756294B1Method for improving bump reliability for flip chip devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 29, 2004·53 cites·26 claims
- 1378US12021042B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 1478US7557423B2Semiconductor structure with a discontinuous material density for reducing eddy currentsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 7, 2009·8 cites·18 claims
- 1578US6602775B1Method to improve reliability for flip-chip device for limiting pad designTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 5, 2003·29 cites·25 claims
- 1677US8097953B2Three-dimensional integrated circuit stacking-joint interface structureTSENG MING-HONG·Filed 2008·Granted Jan 17, 2012·8 cites·20 claims
- 1777US2024312930A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1876US8624360B2Cooling channels in 3DIC stacksCHING KAI-MING·Filed 2009·Granted Jan 7, 2014·6 cites·17 claims
- 1974US8005326B2Optical clock signal distribution using through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 23, 2011·5 cites·19 claims
- 2072US6715524B2DFR laminating and film removing systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 6, 2004·16 cites·16 claims
- 2172US6696356B2Method of making a bump on a substrate without ribbon residueTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 24, 2004·23 cites·30 claims
- 2271US7468321B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 23, 2008·4 cites·20 claims
- 2370US11637072B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 2469US8932906B2Through silicon via bonding structureWANG DEAN·Filed 2008·Granted Jan 13, 2015·4 cites·20 claims
- 2569US7906425B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 15, 2011·4 cites·10 claims
- 2669US7666688B2Method of manufacturing a coil inductorTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Feb 23, 2010·4 cites·20 claims
- 2768US8309396B2System and method for 3D integrated circuit stackingCHING KAI-MING·Filed 2009·Granted Nov 13, 2012·3 cites·19 claims
- 2868US6974659B2Method of forming a solder ball using a thermally stable resinous protective layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 13, 2005·15 cites·19 claims
- 2967US7134199B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 14, 2006·10 cites·13 claims
- 3066US9236359B2System and method for 3D integrated circuit stackingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jan 12, 2016·1 cites·20 claims
- 3166US7888236B2Semiconductor device and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 15, 2011·3 cites·10 claims
- 3265US9006892B2System and method for 3D integrated circuit stackingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 14, 2015·1 cites·20 claims
- 3365US7785927B2Multi-die wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 31, 2010·2 cites·20 claims
- 3464US6638688B2Selective electroplating method employing annular edge ring cathode electrode contactTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 28, 2003·9 cites·14 claims
- 3561US8703609B2Through-substrate via for semiconductor deviceKUO CHEN-CHENG·Filed 2011·Granted Apr 22, 2014·1 cites·11 claims
- 3657US6623912B1Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresistTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 23, 2003·7 cites·39 claims
- 3756US8497584B2Method to improve bump reliability for flip chip deviceCHEN YEN-MING·Filed 2004·Granted Jul 30, 2013·6 cites·9 claims
- 3856US6797075B2Ferris wheel-like stripping or cleaning mechanism for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 28, 2004·5 cites·18 claims
- 3955US9859252B2Cooling channels in 3DIC stacksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 4055US6926818B1Method to enhance the adhesion between dry film and seed metalTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 9, 2005·7 cites·50 claims
- 4154US7276454B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 2, 2007·5 cites·20 claims
- 4254US6918397B2Flush system for dry film photoresist removerTAIWAN SEMICONDUCTOR·Filed 2002·Granted Jul 19, 2005·8 cites·12 claims
- 4352US8456008B2Structure and process for the formation of TSVsKUO CHEN-CHENG·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
- 4449US6802250B2Stencil design for solder paste printingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 12, 2004·1 cites·15 claims
- 4548US8670637B2Optical clock signal distribution using through-silicon viasCHANG SHIH-CHENG·Filed 2011·Granted Mar 11, 2014·0 cites·20 claims
- 4646US9673174B2Through silicon via bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·0 cites·20 claims
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