Inventor · disambiguated record
Chia-Fu Lin
Also filed as: LIN CHIA-FU
17 granted patents·387 citations·filing 2001–2006
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US6743660B2Method of making a wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 1, 2004·110 cites·20 claims
- 0290US6636313B2Method of measuring photoresist and bump misalignmentTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·37 cites·20 claims
- 0389US6756294B1Method for improving bump reliability for flip chip devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 29, 2004·53 cites·26 claims
- 0487US6712260B1Bump reflow method by inert gas plasmaTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 30, 2004·39 cites·61 claims
- 0578US6602775B1Method to improve reliability for flip-chip device for limiting pad designTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 5, 2003·29 cites·25 claims
- 0674US6805279B2Fluxless bumping process using ionsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 19, 2004·28 cites·28 claims
- 0772US6715524B2DFR laminating and film removing systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 6, 2004·16 cites·16 claims
- 0871US7468321B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 23, 2008·4 cites·20 claims
- 0970US6765277B2Microelectronic fabrication with corrosion inhibited bond padTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 20, 2004·17 cites·10 claims
- 1069US7906425B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 15, 2011·4 cites·10 claims
- 1168US6974659B2Method of forming a solder ball using a thermally stable resinous protective layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 13, 2005·15 cites·19 claims
- 1267US7134199B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 14, 2006·10 cites·13 claims
- 1356US8497584B2Method to improve bump reliability for flip chip deviceCHEN YEN-MING·Filed 2004·Granted Jul 30, 2013·6 cites·9 claims
- 1456US6797075B2Ferris wheel-like stripping or cleaning mechanism for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 28, 2004·5 cites·18 claims
- 1554US7276454B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 2, 2007·5 cites·20 claims
- 1654US6918397B2Flush system for dry film photoresist removerTAIWAN SEMICONDUCTOR·Filed 2002·Granted Jul 19, 2005·8 cites·12 claims
- 1749US6802250B2Stencil design for solder paste printingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 12, 2004·1 cites·15 claims
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