Inventor · disambiguated record
Steven R. Codding
Also filed as: CODDING STEVEN R · CODDING STEVEN ROSS
11 granted patents·3 pending applications·53 citations·filing 2003–2010
88Inventor score
Technology areasH10P
Files withIBM14
Top patents by PatentIndex Score
14 records- 0192US7932614B2Method of thinning a semiconductor substrateIBM·Filed 2010·Granted Apr 26, 2011·12 cites·11 claims
- 0283US7867876B2Method of thinning a semiconductor substrateIBM·Filed 2008·Granted Jan 11, 2011·7 cites·18 claims
- 0370US7498236B2Silicon wafer thinning end point methodIBM·Filed 2006·Granted Mar 3, 2009·3 cites·3 claims
- 0468US7348216B2Rework process for removing residual UV adhesive from C4 wafer surfacesIBM·Filed 2005·Granted Mar 25, 2008·3 cites·10 claims
- 0567US7025891B2Method of polishing C4 molybdenum masks to remove molybdenum peaksIBM·Filed 2003·Granted Apr 11, 2006·13 cites·13 claims
- 0666US7700488B2Recycling of ion implantation monitor wafersIBM·Filed 2007·Granted Apr 20, 2010·2 cites·37 claims
- 0763US7387911B2Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and crackingIBM·Filed 2004·Granted Jun 17, 2008·10 cites·14 claims
- 0862US7732303B2Method for recycling of ion implantation monitor wafersIBM·Filed 2008·Granted Jun 8, 2010·1 cites·25 claims
- 0961US7572739B2Tape removal in semiconductor structure fabricationIBM·Filed 2005·Granted Aug 11, 2009·2 cites·12 claims
- 1048US2008099149A1Rework process for removing residual uv adhesive from c4 wafer surfacesIBM·Filed 2008·Application pending·0 cites
- 1145US8034718B2Method to recover patterned semiconductor wafers for reworkIBM·Filed 2008·Granted Oct 11, 2011·0 cites·20 claims
- 1244US2008113456A1Process for protecting image sensor wafers from front surface damage and contaminationIBM·Filed 2006·Application pending·0 cites
- 1342US7666689B2Method to remove circuit patterns from a waferIBM·Filed 2006·Granted Feb 23, 2010·0 cites·4 claims
- 1434US2007054115A1Method for cleaning particulate foreign matter from the surfaces of semiconductor wafersIBM·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →