Inventor · disambiguated record
Sang-Mun Chon
Also filed as: CHON SANG-MUN
41 granted patents·10 pending applications·395 citations·filing 1997–2008
98Inventor score
Top patents by PatentIndex Score
51 records- 0190US6440760B1Method of measuring etched state of semiconductor wafer using optical impedence measurementSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 27, 2002·67 cites·67 claims
- 0287US6706646B1Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 16, 2004·40 cites·6 claims
- 0386US6508887B1Resist removing composition and resist removing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 21, 2003·38 cites·37 claims
- 0485US7605094B2Method of forming metal oxide using an atomic layer deposition processSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·8 cites·12 claims
- 0582US6528333B1Method of and device for detecting micro-scratchesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 4, 2003·28 cites·18 claims
- 0680US7387988B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 17, 2008·4 cites·12 claims
- 0778US7250379B2Method of forming metal oxide using an atomic layer deposition processSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 31, 2007·5 cites·31 claims
- 0876US6449037B2Method of and device for detecting micro-scratchesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 10, 2002·19 cites·4 claims
- 0974US6398874B2Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 4, 2002·11 cites·15 claims
- 1073US7385689B2Method and apparatus for inspecting substrate patternSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·5 cites·35 claims
- 1172US6816029B2RF matching unitSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 9, 2004·9 cites·20 claims
- 1271US7863231B2Thinner composition and method of removing photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 4, 2011·1 cites·6 claims
- 1369US7311857B2Etching composition, method of preparing the same, method of etching an oxide film, and method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 25, 2007·13 cites·3 claims
- 1468US6655042B2System and method for drying semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 2, 2003·12 cites·35 claims
- 1568US6589719B1Photoresist stripper compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 8, 2003·10 cites·22 claims
- 1667US7179537B2Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 20, 2007·11 cites·22 claims
- 1766US7678751B2Composition for removing photoresist, method of removing photoresist and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 16, 2010·1 cites·39 claims
- 1866US7433032B2Method and apparatus for inspecting defects in multiple regions with different parametersSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 7, 2008·2 cites·24 claims
- 1966US5846921ASemiconductor substrate cleaning solutions, methods of forming the same, and methods using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 8, 1998·26 cites·12 claims
- 2062US6515293B1Method and apparatus for detecting thickness of thin layer formed on a waferSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 4, 2003·9 cites·2 claims
- 2161US6682876B2Thinner composition and method of stripping a photoresist using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 27, 2004·7 cites·21 claims
- 2256US7258931B2Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contaminationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 21, 2007·7 cites·6 claims
- 2355US7223721B2Resist and etching by-product removing composition and resist removing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 29, 2007·1 cites·18 claims
- 2455US7183192B2Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the compositionSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 27, 2007·7 cites·14 claims
- 2555US6713440B2Resist and etching by-product removing composition and resist removing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 30, 2004·3 cites·21 claims
- 2653US6503682B1Photoresist composition, preparation method thereof and method for forming a pattern during semiconductor processing using the photoresist compositionSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 7, 2003·4 cites·20 claims
- 2753US6274537B1Use of alkoxy N-hydroxyalkyl alkanamide as resist removing agent, composition for removing resist, method for preparing the same and resist removing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Aug 14, 2001·11 cites·16 claims
- 2852US6927077B2Method and apparatus for measuring contamination of a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 9, 2005·4 cites·21 claims
- 2951US7027638B2Wafer color variation correcting method, selective wafer defect detecting method, and computer readable recording media for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 11, 2006·4 cites·18 claims
- 3050US7858527B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 28, 2010·0 cites·14 claims
- 3149US7271890B2Method and apparatus for inspecting defectsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 18, 2007·2 cites·19 claims
- 3249US7113274B2Method and apparatus for inspecting a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 26, 2006·2 cites·20 claims
- 3348US7573568B2Method and apparatus for detecting a photolithography processing error, and method and apparatus for monitoring a photolithography processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 11, 2009·1 cites·16 claims
- 3448US7310140B2Method and apparatus for inspecting a wafer surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 18, 2007·2 cites·21 claims
- 3547US6869215B2Method and apparatus for detecting contaminants in ion-implanted waferSAMSUNG ELECTRIC·Filed 2003·Granted Mar 22, 2005·2 cites·15 claims
- 3646US6870948B2Method and apparatus for numerically analyzing grain growth on semiconductor wafer using SEM imageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 22, 2005·1 cites·31 claims
- 3746US6165841AMethod for fabricating capacitors with hemispherical grainsSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 26, 2000·15 cites·12 claims
- 3845US7288212B2Additive composition, slurry composition including the same, and method of polishing an object using the slurry compositionSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 30, 2007·1 cites·8 claims
- 3944US7642200B2Methods of forming a thin film and methods of manufacturing a capacitor and a gate structure using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 5, 2010·0 cites·25 claims
- 4043US2006160239A1Method of measuring a level of contamination in a chemical solution and systems thereofLEE SUNG-JAE·Filed 2005·Application pending·0 cites
- 4143US2004226186A1Apparatus for drying semiconductor substrates using azeotrope effect and drying method using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 4241US2004010932A1Apparatus for drying semiconductor substrates using azeotrope effect and drying method using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
- 4341US2006216942A1Wafer carrier for minimizing contacting area with wafersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4441US2005151456A1Electron-beam inspection apparatus and methods of inspecting through-holes using clustered nanotube arraysFiled 2005·Application pending·0 cites
- 4540US6590378B2Real time parameter monitoring apparatus for high voltage chamber in semiconductor wafer processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 8, 2003·1 cites·15 claims
- 4638US2004086167A1Method and apparatus for analyzing a sample employing fast fourier transformationFiled 2003·Application pending·0 cites
- 4737US2006003684A1Grating and clean room system comprising the sameHWANG JUNG-SUNG·Filed 2005·Application pending·0 cites
- 4836US6137018AChemical refining method and reuse system for semiconductor device manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 24, 2000·1 cites·15 claims
- 4935US2005227363A1Methods of monitoring rinsing solutions and related systems and reagentsHWANG DONG-WON·Filed 2004·Application pending·0 cites
- 5035US2005191768A1Apparatus and method for measuring substratesFiled 2005·Application pending·0 cites
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