Inventor · disambiguated record
Leland Swanson
Also filed as: SWANSON LELAND · SWANSON LELAND S · SWANSON LELAND SCOTT
52 granted patents·19 pending applications·971 citations·filing 1993–2013
99Inventor score
Files withTEXAS INSTRUMENTS INC47MICREL INC3SWANSON LELAND SCOTT3UNIV IOWA STATE RES FOUND INC2COYLE ANTHONY L1
Top patents by PatentIndex Score
71 records- 0193US8386814B2Continuous monitoring of a USB client for battery charging specification charging capacityTEXAS INSTRUMENTS INC·Filed 2010·Granted Feb 26, 2013·42 cites·20 claims
- 0292US6537607B1Selective deposition of emissive layer in electroluminescent displaysTEXAS INSTRUMENTS INC·Filed 2000·Granted Mar 25, 2003·50 cites·6 claims
- 0391US9201438B2Buck DC-DC converter with accuracy enhancementMICREL INC·Filed 2012·Granted Dec 1, 2015·13 cites·19 claims
- 0487US7241663B2Maskless multiple sheet polysilicon resistorTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 10, 2007·14 cites·23 claims
- 0587US6376285B1Annealed porous silicon with epitaxial layer for SOITEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 23, 2002·84 cites·8 claims
- 0685US7368991B2System and method for clamping a differential amplifierTEXAS INSTRUMENTS INC·Filed 2006·Granted May 6, 2008·13 cites·21 claims
- 0785US6890836B2Scribe street width reduction by deep trench and shallow saw cutTEXAS INSTRUMENTS INC·Filed 2003·Granted May 10, 2005·28 cites·10 claims
- 0885US6552375B2Blocking of boron diffusion through the emitter-emitter poly interface in PNP HBTs through use of a SiC layer at the top of the emitter epi layerFiled 2002·Granted Apr 22, 2003·31 cites·14 claims
- 0985US6362065B1Blocking of boron diffusion through the emitter-emitter poly interface in PNP HBTs through use of a SiC layer at the top of the emitter epi layerTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 26, 2002·31 cites·14 claims
- 1085US6261892B1Intra-chip AC isolation of RF passive componentsTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 17, 2001·41 cites·20 claims
- 1184US5334539AFabrication of poly(p-phenyleneacetylene) light-emitting diodesUNIV IOWA STATE RES FOUND INC·Filed 1993·Granted Aug 2, 1994·68 cites·20 claims
- 1283US6528426B1Integrated circuit interconnect and methodTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 4, 2003·70 cites·2 claims
- 1382US8922187B2Buck DC-DC converter with improved accuracy and stabilityMICREL INC·Filed 2013·Granted Dec 30, 2014·6 cites·30 claims
- 1482US6555476B1Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectricTEXAS INSTRUMENTS INC·Filed 1998·Granted Apr 29, 2003·65 cites·8 claims
- 1580US6724066B2High breakdown voltage transistor and methodTEXAS INSTRUMENTS INC·Filed 2002·Granted Apr 20, 2004·26 cites·17 claims
- 1679US6503838B1Integrated circuit isolation of functionally distinct RF circuitsTEXAS INSTRUMENTS INC·Filed 2000·Granted Jan 7, 2003·25 cites·20 claims
- 1777US6262445B1SiC sidewall processTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 17, 2001·49 cites·2 claims
- 1876US6949454B2Guard ring structure for a Schottky diodeTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 27, 2005·24 cites·26 claims
- 1975US8880909B2Auto-detect polling for correct handshake to USB clientTOM STEVEN R·Filed 2010·Granted Nov 4, 2014·7 cites·20 claims
- 2075US7498203B2Thermally enhanced BGA package with ground ringTEXAS INSTRUMENTS INC·Filed 2006·Granted Mar 3, 2009·8 cites·9 claims
- 2175US6455393B1Air bridge/dielectric fill inductorsTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 24, 2002·22 cites·32 claims
- 2275US6103590ASiC patterning of porous siliconTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 15, 2000·36 cites·24 claims
- 2372US6376859B1Variable porosity porous silicon isolationTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 23, 2002·40 cites·13 claims
- 2471US8053256B2Variable thickness single mask etch processTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·3 cites·20 claims
- 2571US6765450B2Common mode rejection in differential pairs using slotted ground planesTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 20, 2004·17 cites·26 claims
- 2669US6656811B2Carbide emitter mask etch stopTEXAS INSTRUMENTS INC·Filed 2001·Granted Dec 2, 2003·12 cites·32 claims
- 2768US6580170B2Semiconductor device protective overcoat with enhanced adhesion to polymeric materialsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 17, 2003·13 cites·17 claims
- 2866US7508013B2Versatile system for cross-lateral junction field effect transistorTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 24, 2009·2 cites·5 claims
- 2965US7288800B2Versatile system for cross-lateral junction field effect transistorTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 30, 2007·2 cites·10 claims
- 3065US6787397B2Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabricationTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 7, 2004·11 cites·10 claims
- 3165US6417523B1Organic edge emitting diode with light guide and pixel isolationTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 9, 2002·10 cites·7 claims
- 3261US6847106B1Semiconductor circuit with mechanically attached lidTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 25, 2005·9 cites·20 claims
- 3361US6255211B1Silicon carbide stop layer in chemical mechanical polishing over metallization layersTEXAS INSTRUMENTS INC·Filed 1999·Granted Jul 3, 2001·24 cites·10 claims
- 3459US6861678B2Double diffused vertical JFETTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 1, 2005·7 cites·21 claims
- 3559US6789238B2System and method to improve IC fabrication through selective fusingTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 7, 2004·8 cites·28 claims
- 3658US7034379B2Carbide emitter mask etch stopTEXAS INSTRUMENTS INC·Filed 2003·Granted Apr 25, 2006·6 cites·8 claims
- 3754US7084494B2Semiconductor package having integrated metal parts for thermal enhancementTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 1, 2006·5 cites·16 claims
- 3854US6197654B1Lightly positively doped silicon wafer anodization processTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 6, 2001·18 cites·12 claims
- 3952US7459357B2Versatile system for cross-lateral junction field effect transistorTEXAS INSTRUMENTS INC·Filed 2007·Granted Dec 2, 2008·0 cites·7 claims
- 4052US6909125B2Implant-controlled-channel vertical JFETTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 21, 2005·4 cites·23 claims
- 4150US6780662B2Selective deposition of emissive layer in electroluminescent displaysTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 24, 2004·1 cites·3 claims
- 4250US5352906APoly (p-phenyleneneacetylene) light-emitting diodesUNIV IOWA STATE RES FOUND INC·Filed 1993·Granted Oct 4, 1994·15 cites·20 claims
- 4349US2010167427A1Passive device trimmingTEXAS INSTRUMENTS INC·Filed 2009·Application pending·0 cites
- 4448US7087479B2Method of forming integrated circuit contactsTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 8, 2006·2 cites·7 claims
- 4548US2005140030A1Scribe street width reduction by deep trench and shallow saw cutFiled 2005·Application pending·0 cites
- 4647US6833300B2Method of forming integrated circuit contactsTEXAS INSTRUMENTS INC·Filed 2003·Granted Dec 21, 2004·2 cites·3 claims
- 4747US6420933B1Low distortion current-to-current converterTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 16, 2002·5 cites·20 claims
- 4846US8164386B2Methods and apparatus to control rail-to-rail class AB amplifiersSWANSON LELAND SCOTT·Filed 2007·Granted Apr 24, 2012·2 cites·19 claims
- 4946US2006226521A1Semiconductor Package Having Integrated Metal Parts for Thermal EnhancementCOYLE ANTHONY L·Filed 2006·Application pending·0 cites
- 5044US2009001517A1Thermally enhanced semiconductor devicesSWANSON LELAND SCOTT·Filed 2007·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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