Inventor · disambiguated record
William D. Weber
Also filed as: WEBER WILLIAM · WEBER WILLIAM D
25 granted patents·4 pending applications·546 citations·filing 1983–2013
97Inventor score
Files withARCH SPEC CHEM INC15OLIN MICROELECTRONIC CHEM INC3APROGENEX INC2NAIINI AHMAD A2FUJIFILM ELECTRONIC MATERIALS1
Top patents by PatentIndex Score
29 records- 0195US6929891B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Aug 16, 2005·62 cites·61 claims
- 0293US7803510B2Positive photosensitive polybenzoxazole precursor compositionsFUJIFILM ELECTRONIC MATERIALS·Filed 2006·Granted Sep 28, 2010·27 cites·65 claims
- 0392US7056641B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2005·Granted Jun 6, 2006·19 cites·34 claims
- 0488US6143467APhotosensitive polybenzoxazole precursor compositionsARCH SPEC CHEM INC·Filed 1999·Granted Nov 7, 2000·63 cites·26 claims
- 0587US7132205B2Positive photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Nov 7, 2006·26 cites·43 claims
- 0687US6214516B1Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2000·Granted Apr 10, 2001·29 cites·22 claims
- 0785US6177225B1Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 1999·Granted Jan 23, 2001·55 cites·18 claims
- 0884US7282324B2Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using themNIPPON KAYAKU KK·Filed 2005·Granted Oct 16, 2007·8 cites·28 claims
- 0979US6939659B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Sep 6, 2005·16 cites·40 claims
- 1073US6127086APhotosensitive resin compositionsARCH SPEC CHEM INC·Filed 1999·Granted Oct 3, 2000·31 cites·22 claims
- 1173US5521061AEnhancement of probe signal in nucleic acid-mediated in-situ hybridization studiesAPROGENEX INC·Filed 1992·Granted May 28, 1996·60 cites·57 claims
- 1269US7129011B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Oct 31, 2006·26 cites·52 claims
- 1368US7449280B2Photoimageable coating composition and composite article thereofMICROCHEM CORP·Filed 2004·Granted Nov 11, 2008·12 cites·13 claims
- 1468US5582982ABackground-reducing compounds for probe-mediated fluorimetric flow cytometric assaysAPROGENEX INC·Filed 1994·Granted Dec 10, 1996·44 cites·19 claims
- 1564US4596733AElectroerosion recording material with polyorganosiloxane overlayerIBM·Filed 1983·Granted Jun 24, 1986·17 cites·20 claims
- 1663US7335319B2Semiconductor stress buffer coating edge bead removal compositions and method for their useARCH SPEC CHEM INC·Filed 2003·Granted Feb 26, 2008·9 cites·1 claims
- 1763US7018776B2Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systemsARCH SPEC CHEM INC·Filed 2003·Granted Mar 28, 2006·7 cites·36 claims
- 1860US6511789B2Photosensitive polyimide precursor compositionsARCH SPEC CHEM INC·Filed 2001·Granted Jan 28, 2003·10 cites·5 claims
- 1959US9519216B2Positive photosensitive resin compositionsNAIINI AHMAD A·Filed 2009·Granted Dec 13, 2016·4 cites·40 claims
- 2050US7195849B2Photosensitive resin compositionsARCH SPEC CHEM INC·Filed 2004·Granted Mar 27, 2007·3 cites·58 claims
- 2149US2009111050A1Novel Photosensitive Resin CompositionsNAIINI AHMAD A·Filed 2008·Application pending·0 cites
- 2248US5789524AChemical imidization reagent for polyimide synthesisOLIN MICROELECTRONIC CHEM INC·Filed 1997·Granted Aug 4, 1998·9 cites·7 claims
- 2345US2005260522A1Permanent resist composition, cured product thereof, and use thereofWEBER WILLIAM·Filed 2005·Application pending·0 cites
- 2441US5789525AProcess for making polyimides from diamines and tetracarboxylic diacid diesterOLIN MICROELECTRONIC CHEM INC·Filed 1997·Granted Aug 4, 1998·6 cites·5 claims
- 2540US2004224516A1Semiconductor stress buffer coating edge bead removal compositions and method for their useARCH SPEC CHEM INC·Filed 2004·Application pending·0 cites
- 2637US12189291B2Epoxy formulations and processes for fabrication of relief patterns on low surface energy substratesNAWROCKI DANIEL J·Filed 2012·Granted Jan 7, 2025·0 cites·12 claims
- 2737US2004161619A1Process for producing a heat resistant relief structureARCH SPEC CHEM INC·Filed 2003·Application pending·0 cites
- 2835US5834581AProcess for making polyimide-polyamic ester copolymersOLIN MICROELECTRONIC CHEM INC·Filed 1997·Granted Nov 10, 1998·3 cites·2 claims
- 2928US11635688B2Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substratesKAYAKU ADVANCED MAT INC·Filed 2013·Granted Apr 25, 2023·0 cites·28 claims
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