Inventor · disambiguated record
Yen-Chang Hu
Also filed as: HU YEN-CHANG
18 granted patents·2 pending applications·1,284 citations·filing 2012–2020
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8TAIWAN SEMICONDUCTOR MFG6HU YEN-CHANG4HSIAO CHING-WEN1HUANG HUI-MIN1
Top patents by PatentIndex Score
20 records- 0199US9379078B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·86 cites·20 claims
- 0299US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0398US9087832B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·54 cites·20 claims
- 0497US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 0595US9035461B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·19 cites·19 claims
- 0694US10157884B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
- 0793US9799620B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·9 cites·20 claims
- 0892US9991190B2Packaging with interposer frameHuang hui min·Filed 2012·Granted Jun 5, 2018·14 cites·20 claims
- 0989US9165887B2Semiconductor device with discrete blocksHSIAO CHING-WEN·Filed 2012·Granted Oct 20, 2015·6 cites·17 claims
- 1085US9735087B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 15, 2017·6 cites·20 claims
- 1169US11133274B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 1261US8866285B2Fan-out package comprising bulk metalHU YEN-CHANG·Filed 2012·Granted Oct 21, 2014·1 cites·19 claims
- 1360US11101192B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·20 claims
- 1457US10177073B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1554US10700025B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 30, 2020·0 cites·20 claims
- 1654US8816507B2Package-on-Package structures having buffer dams and method for forming the sameHU YEN-CHANG·Filed 2012·Granted Aug 26, 2014·0 cites·16 claims
- 1748US9418969B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·17 claims
- 1844US9070667B2Peripheral electrical connection of package on packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 30, 2015·0 cites·21 claims
- 1942US2014127857A1Carrier Wafers, Methods of Manufacture Thereof, and Packaging MethodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Application pending·0 cites
- 2040US2014042152A1Variable frequency microwave device and method for rectifying wafer warpageHU YEN-CHANG·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →