Inventor · disambiguated record
Junga Lee
Also filed as: LEE JUNGA
8 granted patents·8 pending applications·1 citations·filing 2019–2025
72Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9SAMSUNG DISPLAY CO LTD3SK INNOVATION CO LTD3HAIER US APPLIANCE SOLUTIONS INC1
Top patents by PatentIndex Score
16 records- 0181US11358382B2Pad printing deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·15 claims
- 0268US12508572B2Carbon dioxide absorbent comprising ionic liquid and alcohol solvent, and method of separating carbon dioxide using the sameSK INNOVATION CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·8 claims
- 0368US12237297B2Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·19 claims
- 0467US12257566B2Carbon dioxide absorbent including phenolate-based ionic liquid and aliphatic alcohol and method of separating carbon dioxide using the sameSK INNOVATION CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0563US2025167166A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0661US2025153143A1Carbon Dioxide Absorbent Comprising Ionic Liquid and Alcohol Solvent, and Method Of Separating Carbon Dioxide Using the SameSK INNOVATION CO LTD·Filed 2025·Application pending·0 cites
- 0758US12494439B2Semiconductor packages having fixing membersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0858US2025022866A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1053US11742294B2Interposers and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1153US2024170448A1Semiconductor package manufacturing method and a bonding device for manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1251US2025132203A1Method for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1349US2024118460A1Window, display device including the window, and manufacturing method thereofSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1448US12382672B2Epitaxial wafer and semiconductor memory device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·19 claims
- 1548US2024224730A1Cover window, manufacturing method of the cover window and display device including the cover windowSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1640US2021111918A1Remote service diagnostics and service scheduling for appliancesHAIER US APPLIANCE SOLUTIONS INC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →