Inventor · disambiguated record
Chih-Tsung Wu
Also filed as: WU CHIH-TSUNG
18 granted patents·1 pending application·27 citations·filing 2008–2024
89Inventor score
Top patents by PatentIndex Score
19 records- 0193US11605559B2Semiconductor device having a landing pad with spacersNANYA TECHNOLOGY CORP·Filed 2021·Granted Mar 14, 2023·2 cites·12 claims
- 0288US11469140B2Semiconductor device having a landing pad with spacers and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Oct 11, 2022·2 cites·15 claims
- 0383US9632822B2Multi-core device and multi-thread scheduling method thereofHTC CORP·Filed 2013·Granted Apr 25, 2017·8 cites·16 claims
- 0479US9361122B2Method and electronic device of file system prefetching and boot-up methodHTC CORP·Filed 2013·Granted Jun 7, 2016·7 cites·10 claims
- 0575US2025014900A1Method for preparing semiconductor device structure with features at different levelsNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0671US12051648B2Semiconductor device with air gap below landing pad and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·5 claims
- 0770US11094632B2Semiconductor device with air gap and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Aug 17, 2021·1 cites·20 claims
- 0869US9274832B2Method and electronic device for thread schedulingHTC CORP·Filed 2013·Granted Mar 1, 2016·3 cites·21 claims
- 0967US12272552B2Method for preparing semiconductor device structure with features at different levelsNANYA TECHNOLOGY CORP·Filed 2022·Granted Apr 8, 2025·0 cites·8 claims
- 1066US11894304B2Semiconductor device with air gap below landing pad and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·8 claims
- 1160US11595085B1System and method for reducing co-locate wireless charging coil and WWAN or WLAN antennas radio frequency exposure to end userDELL PRODUCTS LP·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 1259US8117465B2Mobile device and power control method thereofWU SHANG-YEN·Filed 2008·Granted Feb 14, 2012·3 cites·17 claims
- 1357US9552046B2Performance management methods for electronic devices with multiple central processing unitsHTC CORP·Filed 2013·Granted Jan 24, 2017·1 cites·18 claims
- 1455US11875994B2Method for preparing semiconductor device structure with features at different levelsNANYA TECHNOLOGY CORP·Filed 2022·Granted Jan 16, 2024·0 cites·11 claims
- 1553US11217664B2Semiconductor device with porous dielectric structureNANYA TECHNOLOGY CORP·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 1651US11735616B2Optical semiconductor device with integrated diesNANYA TECHNOLOGY CORP·Filed 2021·Granted Aug 22, 2023·0 cites·14 claims
- 1751US11545556B2Semiconductor device with air gap between gate-all-around transistors and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Jan 3, 2023·0 cites·12 claims
- 1845US10683957B2Pipe connecting jointE HONG XING TECH CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·10 claims
- 1937US9032168B2Memory management methods and systems for mobile devicesCHANG WEN-YEN·Filed 2012·Granted May 12, 2015·0 cites·28 claims
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