Inventor · disambiguated record
Sascha Moeller
Also filed as: MOELLER SASCHA
12 granted patents·5 pending applications·46 citations·filing 2012–2021
87Inventor score
Top patents by PatentIndex Score
17 records- 0193US9847258B2Plasma dicing with blade saw patterned underside maskNXP BV·Filed 2015·Granted Dec 19, 2017·16 cites·14 claims
- 0286US8809166B2High die strength semiconductor wafer processing method and systemNXP BV·Filed 2012·Granted Aug 19, 2014·9 cites·9 claims
- 0384US9601437B2Plasma etching and stealth dicing laser processNXP BV·Filed 2014·Granted Mar 21, 2017·7 cites·19 claims
- 0483US9196537B2Protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 24, 2015·6 cites·15 claims
- 0577US9245804B2Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Jan 26, 2016·4 cites·9 claims
- 0669US8895363B2Die preparation for wafer-level chip scale package (WLCSP)NXP BV·Filed 2013·Granted Nov 25, 2014·3 cites·6 claims
- 0762US9812361B2Combination grinding after laser (GAL) and laser on-off function to increase die strengthNXP BV·Filed 2014·Granted Nov 7, 2017·1 cites·15 claims
- 0857US11168792B2Seal arrangementFREUDENBERG CARL KG·Filed 2018·Granted Nov 9, 2021·0 cites·12 claims
- 0954US2023238632A1Energy storage systemFREUDENBERG CARL KG·Filed 2021·Application pending·0 cites
- 1052US11255438B2Seal arrangementFREUDENBERG CARL KG·Filed 2018·Granted Feb 22, 2022·0 cites·6 claims
- 1144US9349645B2Apparatus, device and method for wafer dicingNXP BV·Filed 2013·Granted May 24, 2016·0 cites·13 claims
- 1243US2016172243A1Wafer material removalNXP BV·Filed 2014·Application pending·0 cites
- 1340US10347534B2Variable stealth laser dicing processNXP BV·Filed 2017·Granted Jul 9, 2019·0 cites·16 claims
- 1440US2019285182A1Seal ring, sealing arrangement, and use of a sealing arrangementFREUDENBERG CARL KG·Filed 2019·Application pending·0 cites
- 1540US2021305095A1Method for forming a packaged semiconductor deviceNXP BV·Filed 2020·Application pending·0 cites
- 1638US2014145294A1Wafer separationNXP BV·Filed 2012·Application pending·0 cites
- 1733US11011446B2Semiconductor device and method of making a semiconductor deviceNexperia BV·Filed 2016·Granted May 18, 2021·0 cites·6 claims
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