Inventor · disambiguated record
Hiroshi Komorita
Also filed as: KOMORITA HIROSHI
19 granted patents·497 citations·filing 1988–2011
96Inventor score
Top patents by PatentIndex Score
19 records- 0188US6426154B1Ceramic circuit boardTOSHIBA KK·Filed 2000·Granted Jul 30, 2002·54 cites·28 claims
- 0282US5672848ACeramic circuit boardTOSHIBA KK·Filed 1994·Granted Sep 30, 1997·68 cites·21 claims
- 0379US5328751ACeramic circuit board with a curved lead terminalTOSHIBA KK·Filed 1992·Granted Jul 12, 1994·61 cites·11 claims
- 0477US6784131B2Silicon nitride wear resistant member and method of manufacturing the memberTOSHIBA KK·Filed 2002·Granted Aug 31, 2004·17 cites·18 claims
- 0576US6232657B1Silicon nitride circuit board and semiconductor moduleTOSHIBA KK·Filed 1997·Granted May 15, 2001·50 cites·24 claims
- 0673US5928768ASilicon nitride circuit boardTOSHIBA KK·Filed 1996·Granted Jul 27, 1999·32 cites·5 claims
- 0769US6040039ASilicon nitride circuit boardTOSHIBA KK·Filed 1997·Granted Mar 21, 2000·27 cites·4 claims
- 0866US5176309AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1991·Granted Jan 5, 1993·31 cites·11 claims
- 0965US5998000ASilicon nitride circuit boardTOSHIBA KK·Filed 1997·Granted Dec 7, 1999·23 cites·7 claims
- 1060US5280850AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1992·Granted Jan 25, 1994·24 cites·11 claims
- 1160US4959507ABonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereofTOSHIBA KK·Filed 1989·Granted Sep 25, 1990·20 cites·6 claims
- 1259US6485830B1Material for ceramic ball and method of manufacturing ceramic ballTOSHIBA KK·Filed 2000·Granted Nov 26, 2002·5 cites·17 claims
- 1357US4987677ABonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereofTOSHIBA KK·Filed 1990·Granted Jan 29, 1991·22 cites·12 claims
- 1456US6605868B2Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layerTOSHIBA KK·Filed 1999·Granted Aug 12, 2003·20 cites·18 claims
- 1556US4954386AJoined ceramic-metal composite substrate and method for production thereofTOSHIBA KK·Filed 1988·Granted Sep 4, 1990·14 cites·11 claims
- 1655US9356101B2Polycrystalline aluminum nitride base material for crystal growth of GaN-base semiconductor and method for manufacturing GaN-base semiconductor using the sameKOMORITA HIROSHI·Filed 2011·Granted May 31, 2016·1 cites·10 claims
- 1754US7263766B2Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrateTOSHIBA KK·Filed 2003·Granted Sep 4, 2007·6 cites·1 claims
- 1847US5155665ABonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereofTOSHIBA KK·Filed 1989·Granted Oct 13, 1992·11 cites·20 claims
- 1944US5363278ABonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereofTOSHIBA KK·Filed 1992·Granted Nov 8, 1994·11 cites·17 claims
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