Inventor · disambiguated record
Holger Hubner
Also filed as: HUBNER HOLGER · HUEBNER HOLGER · HÜBNER HOLGER
18 granted patents·1 pending application·329 citations·filing 1995–2012
93Inventor score
Top patents by PatentIndex Score
19 records- 0192US5902118AMethod for production of a three-dimensional circuit arrangementSIEMENS AG·Filed 1995·Granted May 11, 1999·160 cites·27 claims
- 0283US6872464B2Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 29, 2005·32 cites·20 claims
- 0377US5930596ASemiconductor component for vertical integration and manufacturing methodSIEMENS AG·Filed 1995·Granted Jul 27, 1999·54 cites·3 claims
- 0461US7229851B2Semiconductor chip stackINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 12, 2007·2 cites·5 claims
- 0561US5706578AMethod for producing a three-dimensional circuit arrangementSIEMENS AG·Filed 1995·Granted Jan 13, 1998·29 cites·14 claims
- 0653US6915945B2Method for contact-connecting an electrical component to a substrate having a conductor structureINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 12, 2005·6 cites·14 claims
- 0751US6906370B1Semiconductor component having a material reinforced contact areaINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jun 14, 2005·5 cites·8 claims
- 0851US6709949B2Method for aligning structures on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·5 cites·4 claims
- 0947US5969534ASemiconductor testing apparatusSIEMENS AG·Filed 1995·Granted Oct 19, 1999·13 cites·8 claims
- 1047US2007205253A1Method for diffusion solderingINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 1145US7389903B2Device and method for soldering contacts on semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 24, 2008·2 cites·12 claims
- 1243US7436072B2Protected chip stackINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 14, 2008·0 cites·20 claims
- 1343US6930383B2Electronic component including a housing and a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 16, 2005·3 cites·11 claims
- 1443US6597053B1Integrated circuit arrangement with a number of structural elements and method for the production thereofSIEMENS AG·Filed 1998·Granted Jul 22, 2003·12 cites·20 claims
- 1541US7253530B2Method for producing chip stacksINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 7, 2007·0 cites·10 claims
- 1639US7335582B2ComponentINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 26, 2008·0 cites·15 claims
- 1735US5943563AMethod for producing a three-dimensional circuit arrangementSIEMENS AG·Filed 1995·Granted Aug 24, 1999·6 cites·8 claims
- 1831US9301396B2Connecting element for a multi-chip module and multi-chip moduleHÜBNER HOLGER·Filed 2012·Granted Mar 29, 2016·0 cites·11 claims
- 1929US5830803AMethod for filling contact holes using a doctor bladeSIEMENS AG·Filed 1995·Granted Nov 3, 1998·0 cites·7 claims
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