Inventor · disambiguated record
Jacob D. Haskell
Also filed as: HASKELL JACOB · HASKELL JACOB D · HASKELL JACOB DANIEL
34 granted patents·1 pending application·1,468 citations·filing 1983–2007
98Inventor score
Files withADVANCED MICRO DEVICES INC21SANDISK CORP5AURORA SYS INC3PHILIPS ELECTRONICS NA2VLSI TECHNOLOGY INC2
Top patents by PatentIndex Score
35 records- 0199US6512263B1Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of formingSANDISK CORP·Filed 2000·Granted Jan 28, 2003·329 cites·17 claims
- 0296US6297170B1Sacrificial multilayer anti-reflective coating for mos gate formationVLSI TECHNOLOGY INC·Filed 1998·Granted Oct 2, 2001·240 cites·30 claims
- 0393US4818714AMethod of making a high performance MOS device having LDD regions with graded junctionsADVANCED MICRO DEVICES INC·Filed 1987·Granted Apr 4, 1989·92 cites·20 claims
- 0491US4495025AProcess for forming grooves having different depths using a single masking stepADVANCED MICRO DEVICES INC·Filed 1984·Granted Jan 22, 1985·87 cites·19 claims
- 0587US4729001AShort-channel field effect transistorXEROX CORP·Filed 1983·Granted Mar 1, 1988·43 cites·5 claims
- 0686US5776821AMethod for forming a reduced width gate electrodeVLSI TECHNOLOGY INC·Filed 1997·Granted Jul 7, 1998·80 cites·26 claims
- 0785US6723604B2Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of formingSANDISK CORP·Filed 2002·Granted Apr 20, 2004·24 cites·4 claims
- 0885US4609934ASemiconductor device having grooves of different depths for improved device isolationADVANCED MICRO DEVICES INC·Filed 1984·Granted Sep 2, 1986·38 cites·8 claims
- 0983US4954459AMethod of planarization of topologies in integrated circuit structuresADVANCED MICRO DEVICES INC·Filed 1989·Granted Sep 4, 1990·61 cites·21 claims
- 1082US6953964B2Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of formingSANDISK CORP·Filed 2004·Granted Oct 11, 2005·19 cites·15 claims
- 1181US7288455B2Method of forming non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductorsSANDISK CORP·Filed 2005·Granted Oct 30, 2007·6 cites·5 claims
- 1281US4677589ADynamic random access memory cell having a charge amplifierADVANCED MICRO DEVICES INC·Filed 1985·Granted Jun 30, 1987·41 cites·6 claims
- 1380US4516316AMethod of making improved twin wells for CMOS devices by controlling spatial separationADVANCED MICRO DEVICES INC·Filed 1984·Granted May 14, 1985·47 cites·19 claims
- 1472US4977108AMethod of making self-aligned, planarized contacts for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1989·Granted Dec 11, 1990·27 cites·8 claims
- 1572US4962064AMethod of planarization of topologies in integrated circuit structuresADVANCED MICRO DEVICES INC·Filed 1988·Granted Oct 9, 1990·39 cites·31 claims
- 1671US5081516ASelf-aligned, planarized contacts for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1990·Granted Jan 14, 1992·31 cites·18 claims
- 1768US7541237B2Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of formingSANDISK CORP·Filed 2007·Granted Jun 2, 2009·2 cites·4 claims
- 1867US4964143AEPROM element employing self-aligning processADVANCED MICRO DEVICES INC·Filed 1988·Granted Oct 16, 1990·32 cites·9 claims
- 1965US6133635AProcess for making self-aligned conductive via structuresPHILIPS ELECTRONICS NA·Filed 1997·Granted Oct 17, 2000·32 cites·16 claims
- 2065US5028555ASelf-aligned semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1990·Granted Jul 2, 1991·25 cites·20 claims
- 2165US4974055ASelf-aligned interconnects for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1989·Granted Nov 27, 1990·21 cites·17 claims
- 2264US5055427AProcess of forming self-aligned interconnects for semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1989·Granted Oct 8, 1991·20 cites·14 claims
- 2361US5091326AEPROM element employing self-aligning processADVANCED MICRO DEVICES INC·Filed 1990·Granted Feb 25, 1992·30 cites·23 claims
- 2455US6110818ASemiconductor device with gate electrodes for sub-micron applications and fabrication thereofPHILIPS ELECTRONICS NA·Filed 1998·Granted Aug 29, 2000·15 cites·18 claims
- 2555US5057902ASelf-aligned semiconductor devicesADVANCED MICRO DEVICES INC·Filed 1989·Granted Oct 15, 1991·20 cites·19 claims
- 2646US5395796AEtch stop layer using polymers for integrated circuitsADVANCED MICRO DEVICES INC·Filed 1993·Granted Mar 7, 1995·12 cites·19 claims
- 2746US5116778ADopant sources for cmos deviceADVANCED MICRO DEVICES INC·Filed 1990·Granted May 26, 1992·16 cites·48 claims
- 2839US5198298AEtch stop layer using polymersADVANCED MICRO DEVICES INC·Filed 1989·Granted Mar 30, 1993·7 cites·3 claims
- 2939US4686559ATopside sealing of integrated circuit deviceADVANCED MICRO DEVICES INC·Filed 1984·Granted Aug 11, 1987·8 cites·8 claims
- 3038US4481705AProcess for doping field isolation regions in CMOS integrated circuitsADVANCED MICRO DEVICES INC·Filed 1983·Granted Nov 13, 1984·7 cites·17 claims
- 3136US5136361AStratified interconnect structure for integrated circuitsADVANCED MICRO DEVICES INC·Filed 1989·Granted Aug 4, 1992·6 cites·12 claims
- 3235US6429132B1Combination CMP-etch method for forming a thin planar layer over the surface of a deviceAURORA SYS INC·Filed 1998·Granted Aug 6, 2002·6 cites·35 claims
- 3333US6252999B1Planar reflective light valve backplaneAURORA SYS INC·Filed 1998·Granted Jun 26, 2001·5 cites·34 claims
- 3430US2001051431A1Fabrication process for dishing-free cu damascene structuresFiled 1999·Application pending·0 cites
- 3527US6277748B1Method for manufacturing a planar reflective light valve backplaneAURORA SYS INC·Filed 1998·Granted Aug 21, 2001·0 cites·32 claims
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