Inventor · disambiguated record
Bassam M. Ziadeh
Also filed as: ZIADEH BASSAM · ZIADEH BASSAM M · ZIADEH BASSAM MOHAMMED
17 granted patents·6 pending applications·32 citations·filing 2014–2024
91Inventor score
Top patents by PatentIndex Score
23 records- 0194US9899238B2Low cost package warpage solutionINTEL CORP·Filed 2014·Granted Feb 20, 2018·11 cites·13 claims
- 0291US10741419B2Low cost package warpage solutionINTEL CORP·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 0389US2025096009A1Low cost package warpage solutionINTEL CORP·Filed 2024·Application pending·0 cites
- 0485US12183596B2Low cost package warpage solutionINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 0585US9576942B1Integrated circuit assembly that includes stacked diceINTEL CORP·Filed 2015·Granted Feb 21, 2017·4 cites·14 claims
- 0684US11328937B2Low cost package warpage solutionINTEL CORP·Filed 2020·Granted May 10, 2022·1 cites·33 claims
- 0784US9741692B2Methods to form high density through-mold interconnectionsKARHADE OMKAR G·Filed 2014·Granted Aug 22, 2017·7 cites·14 claims
- 0879US11764080B2Low cost package warpage solutionINTEL CORP·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 0972US10681851B2Pick and place tooling with adjustable nozzle configurationINTEL CORP·Filed 2017·Granted Jun 9, 2020·2 cites·7 claims
- 1071US10580758B2Scalable package architecture and associated techniques and configurationsINTEL CORP·Filed 2018·Granted Mar 3, 2020·1 cites·11 claims
- 1169US2024402445A1Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2024·Application pending·0 cites
- 1264US10483177B2Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packagingINTEL CORP·Filed 2017·Granted Nov 19, 2019·1 cites·25 claims
- 1363US9793244B2Scalable package architecture and associated techniques and configurationsINTEL CORP·Filed 2014·Granted Oct 17, 2017·1 cites·9 claims
- 1462US12130482B2Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·19 claims
- 1562US10403512B2Low cost package warpage solutionINTEL CORP·Filed 2018·Granted Sep 3, 2019·0 cites·16 claims
- 1654US10037976B2Scalable package architecture and associated techniques and configurationsINTEL CORP·Filed 2017·Granted Jul 31, 2018·0 cites·9 claims
- 1753US9991243B2Integrated circuit assembly that includes stacked diceINTEL CORP·Filed 2017·Granted Jun 5, 2018·0 cites·13 claims
- 1853US2025062168A1Method and Stiffeners for Package Level Warpage ModulationINTEL CORP·Filed 2023·Application pending·0 cites
- 1949US2023290661A1Singulated die shipping tray assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 2041US2020395234A1Multi-component trays for transporting integrated circuit diceINTEL CORP·Filed 2019·Application pending·0 cites
- 2139US10529600B2Decoupling systemsINTEL CORP·Filed 2017·Granted Jan 7, 2020·0 cites·19 claims
- 2232US10214340B2Containers for holding and dispensing stacks of electronic device componentsINTEL CORP·Filed 2016·Granted Feb 26, 2019·0 cites·20 claims
- 2326US2018005863A1Minimal contact end-effectors for handling microelectronic devicesINTEL CORP·Filed 2016·Application pending·0 cites
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