Inventor · disambiguated record
Casey Prindiville
Also filed as: PRINDIVILLE CASEY · PRINDIVILLE CASEY L
12 granted patents·1 pending application·83 citations·filing 2000–2005
91Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC13
Top patents by PatentIndex Score
13 records- 0176US6891108B2Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2001·Granted May 10, 2005·15 cites·13 claims
- 0276US6548764B1Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·16 cites·14 claims
- 0368US6776599B2Method and apparatus for gate blocking X-outs during a molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 17, 2004·11 cites·6 claims
- 0467US7163845B2Internal package heat dissipatorMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 16, 2007·3 cites·27 claims
- 0564US6523254B1Method for gate blocking x-outs during a molding processMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·9 cites·18 claims
- 0658US6858927B2Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 22, 2005·5 cites·15 claims
- 0758US6779258B2Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·5 cites·5 claims
- 0856US6949824B1Internal package heat dissipatorMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 27, 2005·6 cites·25 claims
- 0956US6791198B2Method and apparatus for gate blocking X-outs during a molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·5 cites·4 claims
- 1056US6543510B1Apparatus and methods for coverlay removal and adhesive applicationMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 8, 2003·6 cites·8 claims
- 1147US6749711B2Apparatus and methods for coverlay removal and adhesive applicationMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 15, 2004·2 cites·8 claims
- 1240US6833510B2Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 21, 2004·0 cites·7 claims
- 1340US2005034818A1Apparatus and methods for coverlay removal and adhesive applicationMICRON TECHNOLOGY INC·Filed 2004·Application pending·0 cites
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