Inventor · disambiguated record
Yasuhide Ohno
Also filed as: OHNO YASUHIDE
11 granted patents·6 pending applications·258 citations·filing 1980–2014
90Inventor score
Files withNIPPON STEEL CORP7JAPAN SCIENCE & TECH AGENCY3MAEHASHI KENZO3KUMAMOTO TECH & IND FOUND2OHNO YASUHIDE2
Top patents by PatentIndex Score
17 records- 0193US4379482APrevention of cracking of continuously cast steel slabs containing boronNIPPON STEEL CORP·Filed 1980·Granted Apr 12, 1983·35 cites·5 claims
- 0289US5227662AComposite lead frame and semiconductor device using the sameNIPPON STEEL CORP·Filed 1992·Granted Jul 13, 1993·150 cites·15 claims
- 0366US5761779AMethod of producing fine metal spheres of uniform sizeNIPPON STEEL CORP·Filed 1996·Granted Jun 9, 1998·31 cites·19 claims
- 0461US9240561B2Nanodevice and method for fabricating the sameJAPAN SCIENCE & TECH AGENCY·Filed 2013·Granted Jan 19, 2016·2 cites·10 claims
- 0554US2011209980A1Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structureMAEHASHI KENZO·Filed 2011·Application pending·0 cites
- 0652US5164336AMethod of connecting tab tape to semiconductor chip, and bump sheet and bumped tape used in the methodNIPPON STEEL CORP·Filed 1990·Granted Nov 17, 1992·23 cites·9 claims
- 0752US2011214983A1Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structureMAEHASHI KENZO·Filed 2011·Application pending·0 cites
- 0849US7964066B2Method for controlling structure of nano-scale substance, and method for preparing low dimensional quantum structure having nano-scale using the method for controlling structureJAPAN SCIENCE & TECH AGENCY·Filed 2004·Granted Jun 21, 2011·0 cites·11 claims
- 0943US2009014897A1Semiconductor chip package and method of manufacturing the sameKUMAMOTO TECH & IND FOUND·Filed 2008·Application pending·0 cites
- 1042US2007287202A1Method for Producing Nano-Scale Low-Dimensional Quantum Structure, and Method for Producing Integrated Circuit Using the Method for Producing the StructureMAEHASHI KENZO·Filed 2005·Application pending·0 cites
- 1140US5658664AThin gold-alloy wire for semiconductor deviceNIPPON STEEL CORP·Filed 1996·Granted Aug 19, 1997·9 cites·1 claims
- 1236US9825161B2Logical operation elementJAPAN SCIENCE & TECH AGENCY·Filed 2014·Granted Nov 21, 2017·0 cites·13 claims
- 1336US8318585B2Bonding method and bonding apparatusOHNO YASUHIDE·Filed 2009·Granted Nov 27, 2012·0 cites·5 claims
- 1436US2006231927A1Semiconductor chip mounting body and manufacturing method thereofKUMAMOTO TECH & IND FOUND·Filed 2004·Application pending·0 cites
- 1531US5114878AMethod of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the sameNIPPON STEEL CORP·Filed 1991·Granted May 19, 1992·6 cites·13 claims
- 1630US2007170227A1Soldering methodOHNO YASUHIDE·Filed 2005·Application pending·0 cites
- 1727US5491034ABonding wire for semiconductor elementNIPPON STEEL CORP·Filed 1994·Granted Feb 13, 1996·2 cites·12 claims
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