Inventor · disambiguated record
Katsumi Nakasato
Also filed as: NAKASATO KATSUMI
3 granted patents·2 pending applications·35 citations·filing 2002–2023
68Inventor score
Top patents by PatentIndex Score
5 records- 0192US7575150B2Flux composition for solder, solder paste, and method of solderingNOF CORP·Filed 2007·Granted Aug 18, 2009·25 cites·15 claims
- 0284US9581501B2Temperature control materialNIGK CORP·Filed 2015·Granted Feb 28, 2017·9 cites·8 claims
- 0381US12177972B2Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit boardNOF CORP·Filed 2022·Granted Dec 24, 2024·1 cites·12 claims
- 0450US2025185151A1Heat dissipation substrate, heat dissipation circuit board, heat dissipation member, and method for manufacturing heat dissipation substrateNOF CORP·Filed 2023·Application pending·0 cites
- 0535US2004250919A1Flux composition for solder, solder paste, and method of solderingFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →