Inventor · disambiguated record
Yanbo Xu
Also filed as: XU YANBO
6 granted patents·1 pending application·6 citations·filing 2012–2022
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0174US9362212B1Integrated circuit package having side and bottom contact padsFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·3 cites·17 claims
- 0259US9613941B2Exposed die power semiconductor deviceXU YANBO·Filed 2014·Granted Apr 4, 2017·2 cites·6 claims
- 0350US2023068886A1Packaged semiconductor device, leadframe and method for improved bondingNXP USA INC·Filed 2022·Application pending·0 cites
- 0449US9196557B1Protective packaging for integrated circuit deviceBI JIANSHE·Filed 2014·Granted Nov 24, 2015·1 cites·5 claims
- 0544US9252114B2Semiconductor device grid array packageWANG ZHIJIE·Filed 2014·Granted Feb 2, 2016·0 cites·16 claims
- 0641US9214413B2Semiconductor die package with pre-molded dieWANG ZHIJIE·Filed 2014·Granted Dec 15, 2015·0 cites·17 claims
- 0737US8652384B2Method for molding semiconductor deviceCHEN QUAN·Filed 2012·Granted Feb 18, 2014·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →