Inventor · disambiguated record
Minoru Kakitani
Also filed as: KAKITANI MINORU
11 granted patents·3 pending applications·13 citations·filing 2002–2021
81Inventor score
Top patents by PatentIndex Score
14 records- 0180US11377546B2Resin composition, laminate sheet, and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jul 5, 2022·1 cites·11 claims
- 0266US6720077B2Resin composition, and use and method for preparing the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Apr 13, 2004·12 cites·37 claims
- 0364US10907029B2Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radarHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 2, 2021·0 cites·16 claims
- 0462US11691389B2Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·13 claims
- 0559US10940674B2Resin varnish, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 9, 2021·0 cites·16 claims
- 0658US12324105B2Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 0758US7538150B2Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resinHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 26, 2009·0 cites·26 claims
- 0857US11745482B2Fluororesin substrate laminateSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·14 claims
- 0954US10876000B2Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible moduleHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·20 claims
- 1054US2019161586A1Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin compositionHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1152US12024624B2Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jul 2, 2024·0 cites·13 claims
- 1247US2004076805A1Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewithFiled 2002·Application pending·0 cites
- 1345US2023391940A1Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 1444US11136454B2Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 5, 2021·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →