Inventor · disambiguated record
Xin-Hua Huang
Also filed as: HUANG XIN · HUANG Xin-hua
88 granted patents·28 pending applications·1,301 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD64HUANG RU7TAIWAN SEMICONDUCTOR MFG6SHENZHEN JBT SMART LIGHTING CO LTD5CHANGXIN MEMORY TECH INC4
Top patents by PatentIndex Score
116 records- 0199US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 0298US10103122B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·26 cites·20 claims
- 0398US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0498US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 0598US8809123B2Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Aug 19, 2014·238 cites·20 claims
- 0697US11862612B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·4 cites·20 claims
- 0797US11211362B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·6 cites·20 claims
- 0897US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 0997US9834435B1Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·20 cites·20 claims
- 1097US9425155B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·28 cites·20 claims
- 1196US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 1296US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
- 1395US12195017B2Redundant electronic control system and deviceHUAWEI TECH CO LTD·Filed 2022·Granted Jan 14, 2025·3 cites·20 claims
- 1495US9646860B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 9, 2017·19 cites·20 claims
- 1595US9331032B2Hybrid bonding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·24 cites·20 claims
- 1694US10354972B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·7 cites·20 claims
- 1794US9576827B2Apparatus and method for wafer level bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·15 cites·20 claims
- 1893US10497667B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·3 cites·20 claims
- 1991US11222849B2Substrate loss reduction for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·2 cites·20 claims
- 2091US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 2190US12118324B1Domain-specific language modelsAMAZON TECH INC·Filed 2022·Granted Oct 15, 2024·4 cites·20 claims
- 2290US11620041B1Reminder notifications for messagesZOOM VIDEO COMMUNICATIONS INC·Filed 2022·Granted Apr 4, 2023·3 cites·19 claims
- 2390US9748198B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·5 cites·20 claims
- 2490US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 2590US8250926B2Fabrication method of a flexible capacitive pressure sensorYANG YAO-JOE·Filed 2010·Granted Aug 28, 2012·22 cites·19 claims
- 2689US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 2787US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 2886US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2986US10037968B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·4 cites·20 claims
- 3084US10410892B2Method of semiconductor wafer bonding and system thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 10, 2019·6 cites·17 claims
- 3184US8513067B2Fabrication method for surrounding gate silicon nanowire transistor with air as spacersHUANG RU·Filed 2011·Granted Aug 20, 2013·10 cites·9 claims
- 3284US2025273632A13d trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3384US2025118587A1Simultaneous bonding approach for high quality wafer stacking applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3483US12334475B23D trench capacitor for integrated passive devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 3583US12289979B2Deposition system for high accuracy patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 3683US10049901B2Apparatus and method for wafer level bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·3 cites·20 claims
- 3783US2024379570A1Substrate loss reduction for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3882US2024367965A1Conductive bond structure to increase membrane sensitivty in mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3981US12211727B2Simultaneous bonding approach for high quality wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 4081US12148706B2Substrate loss reduction for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 4179US12139399B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 4279US2025230536A1Deposition system for high accuracy patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4378US11854795B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4477US10128209B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·2 cites·20 claims
- 4577US8790946B2Methods of bonding caps for MEMS devicesHUANG Xin-hua·Filed 2012·Granted Jul 29, 2014·5 cites·20 claims
- 4676US11652058B2Substrate loss reduction for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 16, 2023·0 cites·20 claims
- 4775US9887155B2Multiple metal layer semiconductor device and low temperature stacking method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 6, 2018·3 cites·20 claims
- 4874US11621186B2Simultaneous bonding approach for high quality wafer stacking applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 4974US11031369B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·1 cites·20 claims
- 5073US9508586B2Debonding schemesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·2 cites·20 claims
Showing the top 50 of 116 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →