Inventor · disambiguated record
Chun-Cheng Tsao
Also filed as: TSAO CHUN-CHENG
12 granted patents·2 pending applications·126 citations·filing 2000–2009
90Inventor score
Top patents by PatentIndex Score
14 records- 0190US6252222B1Differential pulsed laser beam probing of integrated circuitsSCHLUMBERGER TECHNOLOGIES INC·Filed 2000·Granted Jun 26, 2001·49 cites·26 claims
- 0279US6672947B2Method for global die thinning and polishing of flip-chip packaged integrated circuitsNPTEST LLC·Filed 2001·Granted Jan 6, 2004·31 cites·15 claims
- 0377US7612321B2Optical coupling apparatus for a dual column charged particle beam tool for imaging and forming silicide in a localized mannerDCG SYSTEMS INC·Filed 2005·Granted Nov 3, 2009·7 cites·16 claims
- 0473US7884024B2Apparatus and method for optical interference fringe based integrated circuit processingDCG SYSTEMS INC·Filed 2007·Granted Feb 8, 2011·4 cites·20 claims
- 0572US6955930B2Method for determining thickness of a semiconductor substrate at the floor of a trenchCREDENCE SYSTEMS CORP·Filed 2002·Granted Oct 18, 2005·14 cites·6 claims
- 0653US8173948B2Optical coupling apparatus for a dual column charged particle beam tool for imaging and forming silicide in a localized mannerTSAO CHUN-CHENG·Filed 2009·Granted May 8, 2012·1 cites·20 claims
- 0752US7036109B1Imaging integrated circuits with focused ion beamCREDENCE SYSTEMS CORP·Filed 2002·Granted Apr 25, 2006·2 cites·29 claims
- 0849US7439168B2Apparatus and method of forming silicide in a localized mannerDCG SYSTEMS INC·Filed 2004·Granted Oct 21, 2008·7 cites·12 claims
- 0949US7245133B2Integration of photon emission microscope and focused ion beamCREDENCE SYSTEMS CORP·Filed 2004·Granted Jul 17, 2007·5 cites·52 claims
- 1048US6872581B2Measuring back-side voltage of an integrated circuitNPTEST INC·Filed 2002·Granted Mar 29, 2005·4 cites·25 claims
- 1145US7697146B2Apparatus and method for optical interference fringe based integrated circuit processingDCG SYSTEMS INC·Filed 2006·Granted Apr 13, 2010·0 cites·26 claims
- 1244US6939209B2Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuitsCREDENCE SYSTEMS CORP·Filed 2003·Granted Sep 6, 2005·2 cites·27 claims
- 1337US2005236583A1Method and apparatus for determining thickness of a semiconductor substrate at the floor of a trenchROY ERWAN L·Filed 2005·Application pending·0 cites
- 1434US2004014401A1Method for backside die thinning and polishing of packaged integrated circuitsFiled 2003·Application pending·0 cites
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